GB/T 11072-2009 in English

VALID

Indium antimonide polycrystal,single crystals and as-cut slices

Issued on:2009-10-30
Implemented on:2010-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $140.00
$136.00

Standard No:	GB/T 11072-2009
Document status:	VALID
Title in English:	Indium antimonide polycrystal,single crystals and as-cut slices
Title in Chinese:	锑化铟多晶、单晶及切割片
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2009-10-30
Implemented on:	2010-06-01
Superseding:	GB/T 11072-1989 Indium antimonide polycrystal, single crystals and as-cut slices
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H83-Compound semiconductor material
Professional Classification:	GB-National Standard
Related Keywords:	indium antimonide polycrystal indium antimonide polycrystals single crystals as-cut slices scopethis standard antimonide
Related Topics:	single crystal Polycrystalline Polycrystalline m2 polycrystalline indium hydride Indium grease crystal Crystal Form and Crystal Plane Single crystal polycrystalline xrf indium Indium Antimonide Measuring indium antimonide sheet crystallinity crystal txrf chip Single Crystal Foil Indium emission Crystal English indium + icp multidimensional tablet Single crystal + polycrystalline dsc+indium Wafer Diversity polycrystalline single crystal Primary crystal micro cutting disc How much crystallinity Measuring InSb Three-chip board machine Polycrystalline vs Single Crystal Single crystal standard Single crystal polycrystalline Polycrystalline and Amorphous three chips single crystal target Polycrystalline + single crystal Single crystal + polycrystalline + Single crystal and polycrystalline polycrystalline and monocrystalline Amorphous and Polycrystalline single crystal polycrystalline What about single crystal and polycrystalline Single crystal angle head polycrystalline and amorphous single crystal + phase Single crystal and polycrystalline Wafer CNC Cutting Wafer CNC Cutting How about single crystal and polycrystalline Multi-directional Liquid target single crystal HKUST Indium ptt slice molecular single crystal Crystal faces cutting piece indium dsc super chip Crack Jingjing How about single crystal and polycrystalline indium melting indium+dsc Indium melting temperature Wave Plate Cutting Liquid target single crystal Small cutting discs Single Crystal Bit single chain single crystal Crystallization Seed crystal cutting single crystal secondary crystallization Crystallization peak+ Single Crystal+ platelet cluster How about single crystal polycrystalline lgc indium Indium single atom GBT11072 GBT11072-1989 GB/T 11072-2009 InSb polycrystalline, single crystal and cut sheet polycrystal analysis Crystal silicon cutting fluid Enzyme fragmentation disco wafer cutting machine Cutting machine cutting disc parameters How much is indium poisoning? One piece Cut slice execution Silicon wafer multi-wire cutting Aluminum nitride wafer national standard Polycrystalline Wire cutting standardization Cutting machine standardization Single wafer preparation method gb/t 11072-2009 Indium antimonide industry Gallium antimonide cutting disc Standard single crystal for single crystal instrument Single crystal and polycrystalline analysis methods

《GB/T 11072-2009锑化铟多晶、单晶及切割片》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了锑化铟多晶、单晶及单晶切割片的产品分类、技术要求和试验方法等。
本标准适用于区熔法制备的锑化铟多晶及直拉法制备的供制作红外探测器和磁敏元件等用的锑化铟多晶、单晶及切割片。

Scope

This standard specifies the product classification, technical requirements, test methods, etc. It is suitable for indium antimonide polycrystals prepared by zone melting method and indium antimonide polycrystals, single crystals and cut sheets prepared by Czochralski method for making infrared detectors and magnetic sensitive elements.

More samples: JGJ 94-2008 DL/T 5154-2012 NB/T 47013.2-2015

Sample only — not a preview of GB/T 11072-2009

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