GB/T 12964-2018 in English

VALID

Monocrystalline silicon polished wafers

Issued on:2018-09-17
Implemented on:2019-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $160.00
$156.00

Standard No:	GB/T 12964-2018
Document status:	VALID
Title in English:	Monocrystalline silicon polished wafers
Title in Chinese:	硅单晶抛光片
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2018-09-17
Implemented on:	2019-06-01
Superseding:	GB/T 12964-2003 Monocrystalline silicon polished wafers
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H82-Elemental semiconductor material
Professional Classification:	GB-National Standard
Related Keywords:	silicon wafers large-size silicon wafers silicon single crystal polishing wafer monocrystalline silicon geometric parameter optimization taking silicon
Related Topics:	polishing Spectroscopic crystal standard silicon wafer crystal Single crystal silicon inspection Detection of single crystal silicon Silicon Spectrum Silicon Spectrum Spectrum of crystalline silicon Single crystal silicon inspection Single Crystal Foil Double jet polishing Polisher Single crystal silicon peak Crystal Core Optoelectronics Three-chip board machine How to detect single crystal silicon Polycrystalline vs Single Crystal three chips single crystal target Silicon crystallization peak photometric film polycrystalline and monocrystalline Single crystal angle head How to measure single crystal silicon single crystal + phase single crystal fluorescence crystal polishing monolithic photon Wafer analysis monolithic photon How about single crystal and polycrystalline Wafer analysis Liquid target single crystal molecular single crystal single crystal fluorescence super chip gb12964 light sheet light silicon wafer for testing crystal light gb 12964 Jujing Optoelectronics Liquid target single crystal Silicon Single Wafer Orienter Single Crystal Bit Silicon single crystal orientation single chain single crystal Optical film type single crystal secondary crystallization jar polish platelet cluster Single crystal silicon target GBT12964 GB/T 12964-2003 GB/T 12964-2018 Silicon single crystal polished wafer wafer polishing Optical double-sided polished aperture National production of monocrystalline silicon polishing disc Electronic silicon single crystal Monocrystalline silicon seed technology Gallium antimonide single crystal polished wafer Monocrystalline silicon seed crystal Photosynthetic silicon energy Silicon single crystal seed crystal Monocrystalline Silicon International Single crystal silicon seed crystal standard project establishment Monocrystalline silicon quality Monocrystalline silicon product quality Monocrystalline silicon Japan Monocrystalline silicon crystal growth furnace Single wafer preparation method Copper polishing Standard single crystal for single crystal instrument Silicon wafer

《GB/T 12964-2018硅单晶抛光片》由TC203（全国半导体设备和材料标准化技术委员会）归口，TC203SC2（全国半导体设备和材料标准化技术委员会材料分会）执行，主管部门为国家标准化管理委员会。

Introduction

1. Background of standard formulation and analysis of technological evolution

GB/T 12964-2018 "Silicon Single Crystal Polishing Wafer" is a technical standard for silicon single crystal polishing wafer, a key material in the semiconductor industry, replacing the previous GB/T12964-2003 version. With the rapid development of semiconductor technology, silicon single crystal polishing wafers are increasingly used in integrated circuits, discrete components and other fields, and higher requirements are placed on the quality and performance of materials.

The main revisions to this standard include:

The scope of application has been expanded to cover silicon single crystal polishing wafers prepared by the CZ method and the FZ method, with a diameter of no more than 200mm.
The requirements for the surface metal and bulk metal (iron) content of silicon wafers with a diameter of 150mm and 200mm have been added.
The requirements for geometric parameters, electrical properties and surface quality have been optimized to meet the needs of more advanced semiconductor manufacturing processes.

2. Comparative analysis of standard frameworks

Standard items	Requirements of the 2003 version	Revised contents of the 2018 version
Scope of application	Applicable only to silicon polishing wafers prepared by etching and thinning of CZ silicon single crystal grinding wafers.	Expanded to include silicon polishing wafers prepared by CZ method and floating zone melting method (including neutron variable doping and gas phase doping), with a clear diameter of no more than 200mm.
Classification	According to the silicon single crystal growth method, it is divided into CZ (CZ) and floating zone melting (FZ).	Added surface orientation classification, including the commonly used {100}, {110}, and {111}.
Geometric parameter requirements	The specific values of local flatness and curvature are not specified.	Added local flatness requirements for silicon polishing wafers with a diameter of not less than 125mm, and clarified the specific parameter limits within different diameter ranges.

Case Study: Geometric Parameter Optimization

Taking silicon polishing wafers with diameters of 150mm and 200mm as an example, the local flatness requirements are increased from the original ≤1.5μm (15mm×15mm) to ≤0.8μm (25mm×25mm), reflecting the standard's higher precision requirements for large-size silicon wafers. This optimization not only meets the needs of advanced semiconductor manufacturing processes, but also promotes the development of related testing technologies.

3. Implementation Suggestions

In order to ensure the smooth implementation of GB/T 12964-2018, it is recommended that:

Suppliers: Strengthen internal quality management, and strictly carry out production and inspection in accordance with standard requirements, especially the newly added surface metal and body metal content detection.
Purchasers: Clarify various technical indicators when signing the contract, and negotiate with suppliers to determine the specific requirements of some projects based on actual needs.
Testing agencies: Use automated, high-precision testing equipment to ensure effective evaluation of geometric parameters (such as curvature, local flatness) and surface quality.
Industry collaboration: Promote upstream and downstream semiconductor companies to jointly establish a standard compliance verification mechanism to promote technical exchanges and cooperation.

More samples: YD/T 3934-2021 GB 18306-2015 DL/T 5154-2012

Sample only — not a preview of GB/T 12964-2018

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