GB/T 17461-1998 in English

《GB/T 17461-1998金属覆盖层 锡-铅合金电镀层》由TC57（全国金属与非金属覆盖层标准化技术委员会）归口，主管部门为中国机械工业联合会。
本标准规定了含锡量范围为50%~70%(质量比)的锡-铅合金电镀层的技术要求和试验方法。本标准适用于电子、电气制品及其他金属制品上防止腐蚀和改善焊接性能的锡-铅合金电镀层。本标准也适用于其他成分的锡－铅合金电镀层，但使用时应注意这些镀层的性能可能与上述合金成分范围的锡-铅合金镀层不同。

Scope

This standard specifies the technical requirements and test methods (see 10.3) for the tin-lead alloy electroplating layer ¹) with a tin content ranging from 50% to 70% (mass ratio). This standard is applicable to the tin-lead alloy plating layer on electronic, electrical products and other metal products to prevent corrosion and improve soldering performance. This standard is also applicable to tin-lead alloy coatings of other compositions, but it should be noted that the properties of these coatings may be different from those of tin-lead alloy coatings in the above alloy composition range. The classification method in this standard clearly expresses the category of the base metal and the coating composition within a certain range of tin content, as well as the regulations on the hot-melt layer and bright deposit layer. This standard does not apply to: a) tin-lead alloy coatings on threaded parts; b) tin-lead alloy coatings on bearings;