GB/T 28277-2012 in English
VALIDSilicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area
- Issued on:2012-05-11
- Implemented on:2012-12-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
$321.00
《GB/T 28277-2012硅基MEMS制造技术 微键合区剪切和拉压强度检测方法》由TC336(全国微机电技术标准化技术委员会)归口,主管部门为国家标准化管理委员会。
Scope
This standard specifies the requirements and test methods for testing the bonding strength of tiny bonding areas involved in the processing of silicon-based MEMS. This standard applies to the shear and tensile and compressive strength tests of tiny bonding areas manufactured by microelectronics technology and related microfabrication technologies.

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