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Database: 365,228(8 Aug 2026)
bonding strength silicon-based mems fabrication technology measurement method silicon-based mems pull-press strength compressive strength tests electromechanical control circuit devices sample information collection introduction low-frequency sound pressure field calibration method
GB/T 28277-2012 in English

GB/T 28277-2012 in English

VALID

Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area

  • Issued on:2012-05-11
  • Implemented on:2012-12-01
  • File Format:PDF
  • Delivery:Via email within 1~3 business days
Price(USD): $330.00
$321.00

《GB/T 28277-2012硅基MEMS制造技术 微键合区剪切和拉压强度检测方法》由TC336(全国微机电技术标准化技术委员会)归口,主管部门为国家标准化管理委员会。


Scope

This standard specifies the requirements and test methods for testing the bonding strength of tiny bonding areas involved in the processing of silicon-based MEMS. This standard applies to the shear and tensile and compressive strength tests of tiny bonding areas manufactured by microelectronics technology and related microfabrication technologies.

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