GB/T 31351-2014 in English
SUPERSEDEDNondestructive test method for micropipe density of polished monocrystalline silicon carbide wafers
- Issued on:2014-12-31
- Implemented on:2015-09-01
- File Format:PDF
- Delivery:Via email within 1~3 business days
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《GB/T 31351-2014碳化硅单晶抛光片微管密度无损检测方法》由TC203(全国半导体设备和材料标准化技术委员会)归口,TC203SC2(全国半导体设备和材料标准化技术委员会材料分会)执行,主管部门为国家标准化管理委员会。
本标准规定了4H晶型和6H晶型碳化硅单晶抛光片的微管密度的无损检测方法。
本标准适用于4H晶型和6H晶型碳化硅单晶抛光片经单面抛光或双面抛光后、微管的径向尺寸在一微米至几十微米范围内的微管密度的测量。
Scope
This standard specifies the non-destructive testing method for the micropipe density of 4H and 6H silicon carbide single crystal polished wafers. This standard is applicable to the measurement of the micropipe density with the radial size of micropipes in the range of one micron to tens of microns after single-side polishing or double-side polishing of 4H crystal and 6H crystal silicon carbide single crystal polished wafers.

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