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Database: 365,228(8 Aug 2026)
feature specification degree countersunk head steel iso method
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  2. GB/T 47837.4017-2026 in English
GB/T 47837.4017-2026 in English

GB/T 47837.4017-2026 in English

TO BE VALID

Materials for printed circuit boards and other interconnecting structures—Part 4-17: Prepreg for multilayer printed circuit boards—Non-halogenated epoxide woven E-glass prepreg for lead-free assembly

  • Issued on:2026-07-02
  • Implemented on:2027-02-01
  • File Format:PDF
  • Delivery:Via email within 5 business days
Price(USD)： $510.00
$495.00
Standard No: GB/T 47837.4017-2026
Document status: TO BE VALID
Title in English: Materials for printed circuit boards and other interconnecting structures—Part 4-17: Prepreg for multilayer printed circuit boards—Non-halogenated epoxide woven E-glass prepreg for lead-free assembly
Title in Chinese: 印制电路板及其他互连结构用材料 第4-17部分：多层印制电路板用粘结片 无铅装联用无卤环氧E玻纤布粘结片
Language: English
File Format: Electronic (PDF)
Delivery: Via email within 5 business days
Issued on: 2026-07-02
Implemented on: 2027-02-01
ICS Classification: 31.180-Printed circuits and boards
Chinese Classification: L30-Printed circuit
Professional Classification: GB-National Standard

《GB/T 47837.4017-2026印制电路板及其他互连结构用材料 第4-17部分：多层印制电路板用粘结片 无铅装联用无卤环氧E玻纤布粘结片》由TC47（全国印制电路标准化技术委员会）归口，主管部门为工业和信息化部（电子）。


More samples: YD/T 3934-2021 DL/T 5154-2012 NB/T 47013.2-2015
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