Reliability Test Semiconductor

Reliability Test Semiconductor, Total:108 items.

The international standard classification for "Reliability Test Semiconductor" includes: Electronic components in general , Measuring instruments .

The Chinese standard classification for "Reliability Test Semiconductor" includes: Reliability and maintainability , Electronic measurement and equipment in general .

Group Standards of the People's Republic of China

T/CIE 144-2022 Reliability enhancement test of semiconductor devices
T/CIE 198-2023 Reliability test specification for flexible semiconductor integrated circuits
T/IAWBS 004-2021 General Requirements and Test Methods for Reliability Test of Power Semiconductor Modules Used in Electric Vehicles
T/ZSA 47-2020 Reliability test methods for power semiconductor devices in electric vehicle applications
T/CEEIA 650-2022 Reliability test and evaluation for automated guided vehicle

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 24468-2009 Specification for definition and measurement of semiconductor equipment reliability availability and maintainability(RAM)

Taiwan Provincial Standard of the People's Republic of China

CNS 6127-1986 General Rules for Reliability Assured Discrete Semiconductor Devices

British Standards Institution (BSI)

20/30409285 DC BS IEC 63284. Semiconductor devices. Reliability test method of on-stress reliability by inductive load switching for gallium nitride transistors
BS IEC 63284:2022 Semiconductor devices. Reliability test method by inductive load switching for gallium nitride transistors
14/30297227 DC BS EN 62880-1. Semiconductor devices. Wafer level reliability for semiconductor devices. Copper stress migration test method
BS EN IEC 63287-1:2021 Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
BS IEC 63275-1:2022 Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Test method for bias temperature instability
BS IEC 62951-5:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for thermal characteristics of flexible materials
BS EN IEC 60749-41:2020 Semiconductor devices. Mechanical and climatic test methods. Standard reliability testing methods of non-volatile memory devices
23/30478757 DC BS EN IEC 63287-3. Semiconductor devices. Generic semiconductor qualification guidelines - Part 3. Guidelines for reliability qualification plans for power semiconductor module
BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Part 43 : Guidelines for IC reliability qualification plans
BS IEC 62951-7:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
20/30406230 DC BS IEC 63275-1. Semiconductor devices. Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors. Part 1. Test method for bias temperature instability
BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
BS EN IEC 60749-30:2020 Semiconductor devices. Mechanical and climatic test methods - Preconditioning of non-hermetic surface mount devices prior to reliability testing
BS EN IEC 63287-2:2023 Semiconductor devices. Guidelines for reliability qualification plans Concept of mission profile (British Standard)
BS IEC 62951-8:2023 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for stretchability, flexibility, and stability of flexible resistive memory
19/30350992 DC BS EN IEC 60749-41. Semiconductor devices. Mechanical and climatic test methods. Part 41. Standard reliability testing methods of non-volatile memory devices

German Institute for Standardization

DIN EN 62880-1 E:2014-08 Semiconductor devices - Semiconductor wafer level reliability - Part 1: Copper stress migration test method
DIN EN IEC 63287-1:2020-06 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for LSI reliability qualification (IEC 47/2614/CDV:2020); German and English version prEN IEC 63287-1:2020 / Note: Date of issue 2020-05-08*Intended as replacem...
DIN V VDE V 0884-10:2006 Semiconductor devices - Magnetic and capacitive couplers for safe isolation
DIN EN 62880-1 E:2014 Draft Document - Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
DIN EN 60749-43:2018-05 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017 / Note: To be replaced by DIN EN IEC 63287-1 (2020-06).
DIN EN 60749-43 E:2013-10 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
DIN EN IEC 60749-41:2023-03 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020); German version EN IEC 60749-41:2020
DIN EN IEC 63287-1:2023 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (IEC 63287-1:2021); German version EN IEC 63287-1:2021
DIN EN 60749-43:2018 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
DIN EN IEC 60749-30:2023-02 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remain...
DIN EN 60749-41 E:2017 Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016)

Korean Agency for Technology and Standards (KATS)

KS C 5212-1981(2002) GENERAL RULES FOR RELIABILITY ASSURED DISCRETE SEMICONDUCTOR DEVICES
KS C 5212-1981 GENERAL RULES FOR RELIABILITY ASSURED DISCRETE SEMICONDUCTOR DEVICES
KS C 5210-1980 General rules for reliability assured digital semiconductor integrated circuits
KS C 5210-1980(2020) General rules for reliability assured digital semiconductor integrated circuits
KS C 7202-1990 General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
KS C 5218-1983 Reliability assured complementary MOS digital semiconductor integrated circuits(Gates)
KS C 5218-1983(2013) Reliability assured complementary MOS digital semiconductor integrated circuits(Gates)
KS C 7202-1990(2021) General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
KS C 5218-2020 Reliability assured complementary MOS digital semiconductor integrated circuits(Gates)
KS C 7202-2021 General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
KS C 5210-2020 General rules for reliability assured digital semiconductor integrated circuits

GCC Standardization Organization

GSO IEC 63284:2024 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors
GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
GSO IEC 63275-1:2024 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO IEC 63284:2024 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors
BH GSO IEC 63287-1:2024 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
BH GSO IEC 63275-1:2024 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability
BH GSO IEC 60749-30:2016 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Japanese Industrial Standards Committee (JISC)

JIS C 7210:1977 General rules for reliability assured discrete semiconductor devices
JIS C 7410:1981 General rules for reliability assured analogue semiconductor integrated circuits
JIS C 7310:1979 General rules for reliability assured digital semiconductor integrated circuits
JIS C 7312:1982 Reliability assured complementary MOS digital semiconductor integrated circuits (gates)

Danish Standards Foundation

DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
DANSK DS/IEC 63284:2022 Semiconductor devices – Reliability test method by inductive load switching for gallium nitride transistors
DANSK DS/EN IEC 63287-1:2021 Semiconductor devices – Generic semiconductor qualification guidelines – Part 1: Guidelines for IC reliability qualification
DANSK DS/EN 60749-43:2017 Semiconductor devices – Mechanical and climatic test methods – Part 43: Guidelines for IC reliability qualification plans
DANSK DS/EN IEC 60749-41:2020 Semiconductor devices – Mechanical and climatic test methods – Part 41: Standard reliability testing methods of non-volatile memory devices
DANSK DS/IEC 63275-2:2022 Semiconductor devices – Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors – Part 2: Test method for bipolar degradation due to body diode operation
DANSK DS/EN 60749-30:2005 Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DANSK DS/EN IEC 63287-2:2023 Semiconductor devices – Guidelines for reliability qualification plans – Part 2: Concept of mission profile
DS/EN 60749-30/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DS/EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
DANSK DS/EN IEC 60749-30:2020 Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

International Electrotechnical Commission (IEC)

IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
IEC 63284:2022 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors
IEC 63275-1:2022 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability
IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (Edition 1.0)
IEC 62951-7:2019 Semiconductor devices – Flexible and stretchable semiconductor devices – Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor (Edition 1.0)

Swedish Institute for Standards

SS-EN IEC 63287-1:2022 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
SS-EN IEC 63287-2:2024 Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

Spanish Association for Standardization (UNE)

UNE-EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)
UNE-EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (Endorsed by Asociación Española de Normalización in October of 2017.)
UNE-EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN IEC 63287-2:2023 Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (Endorsed by Asociación Española de Normalización in June of 2023.)
UNE-EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN 60749-30:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
UNE-EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Association Francaise de Normalisation

NF C96-287-1*NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1 : guidelines for IC reliability qualification
NF EN IEC 63287-1:2021 Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Integrated circuit reliability qualification guidelines
NF EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: standard test methods for reliability of non-volatile memory devices
NF EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: preconditioning of non-hermetic surface mount components before reliability testing

Comitato Elettrotecnico Italiano

CEI EN IEC 63287-1:2022 Semiconductor devices - Generic semiconductor qualification guidelines Part 1: Guidelines for IC reliability qualification
CEI EN 60749-43:2018 Semiconductor devices - Mechanical and climatic test methods Part 43: Guidelines for IC reliability qualification plans
CEI EN IEC 60749-41:2021 Semiconductor devices - Mechanical and climatic test methods Part 41: Standard reliability testing methods of non-volatile memory devices
CEI EN IEC 60749-30:2021 Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
CEI EN 60749-30/A1:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
CEI EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

AT-OVE/ON

OVE EN IEC 63284:2021 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors (IEC 47/2681/CDV) (english version)

SE-SIS

SIS SS IEC 605:1989 Dependability — Equipment reliability testing

Defense Logistics Agency

DLA MIL STD 750 5 F-2012 TEST METHOD STANDARD HIGH RELIABILITY SPACE APPLICATION TEST METHODS FOR SEMICONDUCTOR DEVICES PART 5: TEST METHODS 5000 THROUGH 5999

RO-ASRO

STAS R 12007/1-1981 EQUIPMENT RELIABILITY TESTING General requirements

FI-SFS

SFS 5493-1989 Equipment reliability testing. total requirements

Association of German Mechanical Engineers

VDI 4009 E:2020-12 Reliability tests
VDI 4009-2022 Reliability tests

PH-BPS

PNS IEC 60749-43:2021 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JEP148A-2008 Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment
JEDEC JEP148B-2014 Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 60749-30:2014 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Lithuanian Standards Office

LST EN IEC 60749-41:2020 Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (IEC 60749-41:2020)

Others: Semiconductor Test Equipment,Semiconductor Test Program,reliability test,Semiconductor Test Instruments,reliability test,semiconductor testing,semiconductor testing,Semiconductor Reliability Testing,Power Semiconductor Testing,Semiconductor Test Equipment,Semiconductor Test Technology,semiconductor reliability,Semiconductor Test Technology,Semiconductor Analysis Test,semiconductor reliability,Principles of Semiconductor Testing,Reliability Test Semiconductor,Semiconductor Test Analysis