Temperature and humidity pressing chips

Temperature and humidity pressing chips, Total:143 items.

The international standard classification for "Temperature and humidity pressing chips" includes: Measurement of force, weight and pressure , Integrated circuits. Microelectronics , Medical equipment , Other materials for the reinforcement of composites , Motion picture films. Cartridges , Laboratory medicine , Mechanical testing , Waterproofing , Geology. Meteorology. Hydrology .

The Chinese standard classification for "Temperature and humidity pressing chips" includes: Material and component for instrument and meter , Papermaking in general , Microcircuit in general , Medical laboratory equipment , Fibre reinforced composites , Photosensitive material , Medical apparatus and devices in general , Mechanical vibration, impact equipment and dynamic balancing machine , Roof and pavement waterproof and barrier material , Meteorology , Daily-use hardware , Basic standards and general methods for photosensitive material .

Professional Standard - Agriculture

315药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wenhuashuishi Shenyanshu Granules (Tablets, Capsules)
321药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wenhuashuishirenyan Wenyang Tablets
314药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wenhuashuishishen Kangning Tablets
药品检验补充检验方法和检验项目批准件编号2003007 Xi Xi Rheumatic Tablets
313药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wenhua Shuishi Qiangshen Granules (tablets)
316药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wen Hua Shui Damp Nephritis Anti-tumor Tablets
317药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (V) Wen Huashui Damp Nephritis Rehabilitation Tablets
311药典中药成方制剂卷-2010 Discussions on Internal Medicine VIII. Dehumidifiers (5) Warming Shuishi Wuling Powder (tablets)

Professional Standard - Machinery

JB/T 6862-2014 Thermohygrograph
JB/T 6862-1993 Hygrometer
JB/T 13778-2020 Positive temperature coefficient thermistor for compressor starter

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 31295-2014 The core to wind turbine blade―Determination of dimensional stability at elevated temperatures with flexural load and with compressive load
GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
GB/T 22906.2-2008 Testing of cores—Part 2:Conditioning of test samples
GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls
GB/T 41521-2022 General technical requirement of microfluidic chip for multi-index nucleic acid isothermal amplification and detection
GB/T 33752-2017 Aldehyde slide for microarrays
GB/T 44279-2024 Temperature-humdity-vibration-low pressure combined environmental testing system
GB/T 33922-2017 Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
GB/T 28856-2012 Silicon piezoresistive pressure-sensitive chip

Group Standards of the People's Republic of China

T/SICA 003-2022 Technical specification for dual-frequency multi-interface temperature and humidity detection tag chip based on RFID transmission and storage technology
T/ZS 0646-2024 IC level flip chip die bonder
T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
T/CASME 53-2022 Temperature and humidity controller for high voltage switchgear
T/CSPSTC 11-2018 Rapid determination of pathogenic bacteria in food Biochip method
T/CIET 1002-2025 Biochip Analyzer
T/CECS 10173-2022 Thermally cross-linked polymer felt with skin-core structure based wet installed waterproofing sheets
T/ZSA 301-2025 Monolithic integrated coherent optical receiver chip

未注明发布机构

FORD ESL-M8G196-A-1987 GASKET, PERFORATED STEEL CORE - COMPRESSED GRAPHITE SHEET
JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)
JEDEC JESD93A-2022 Multichip Modules (MCM)
FORD ESE-M8G168-A-1990 GASKET, STEEL CORE - COMPRESSED NON-ASBESTOS - SHEET
JEDEC JESD22-A118B.01-2018 ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
FORD ESE-M8G201-A-1991 GASKET, PERFORATED - STEEL CORE - COMPRESSED GRAPHITE SHEET
FORD ESE-M8G169-A2-2000 GASKET, STEEL CORE - COMPRESSED GRAPHITE SHEET (Shown on ESE-M8G169-A)
FORD ESE-M8G169-A-2000 GASKET, STEEL CORE - COMPRESSED GRAPHITE SHEET
FORD WSE-M8G227-A-1994 GASKET, STEEL CORE - COMPRESSED GRAPHITE SHEET

Professional Standard - Meteorology

QX/T 121-2010 Coding specifications for upper-level pressure, temperature, humidity and wind report
QX/T 626-2021 Digitization of pressure , air temperature , relative humidity autographic records

Professional Standard - Medicine

YY/T 1152-2009 Aldehyde slide for biochips

Professional Standard - Light Industry

QB/T 2475-2000 Blade Cored Door Lock

National Metrological Technical Specifications of the People's Republic of China

JJF(纺织)104-2021 Calibration Specification for Textile Laboratory with Constant Temperature and Humidity
JJF(纺织) 104-2021 Calibration Specification for Textile Laboratory with Constant Temperature and Humidity

Professional Standard - Chemical Industry

HG/T 3558-1988 Method for determination of the moisture content of photographic film and film base
HG/T 3558-2019 Method for determination of moisture content of photographic film and film base

The American Society of Agricultural and Biological Engineers

ASAE D309.1-1987(2017) Wet Bulb Temperature and Wet Bulb Decompression

General Motors Corporation (GM)

GM 9985524-1989 Coating, Chip Resistant Plastisol, Low Temperature Cure

Japanese Industrial Standards Committee (JISC)

JIS B 1402:1995 Oil hydraulic multiple disc clutches (Wet type)

Korean Agency for Technology and Standards (KATS)

KS B 4081-2020 Oil hydraulic multiple disc clutches(wet type)
KS B 4081-1982 Oil hydraulic multiple disc clutches(wet type)
KS B 4081-2007 Oil hydraulic multiple disc clutches(wet type)
KS B 4081-2014 Oil hydraulic multiple disc clutches(wet type)
KS I ISO 8756-2020 Air quality－Handling of temperature, pressure and humidity data
KS I ISO 8756-2005(2020) Air quality－Handling of temperature, pressure and humidity data
KS I ISO 8756:2005 Air quality-Handling of temperature, pressure and humidity data

American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE)

ASHRAE 3859-1995 Temperature and Humidity Control During Cooling and Dehumidifying by Compressor and Evaporator Fan Speed Variation
ASHRAE 3901-1995 Experimental Study of Temperature@ Pressure@ Humidity@ and/or Density Effects on Vane Anemometers

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 1450.6.1-2009 Describing on-chip scan compression

Defense Logistics Agency

DLA DSCC-DWG-03017 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303
DLA DSCC-DWG-03018 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, NEGATIVE TEMPERATURE COEFFICIENT (NTC), STYLE 0404
DLA DESC-DWG-89089 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
DLA AN6238 REV 4 VALID NOTICE 2-2013 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
DLA AN6238 REV 4 VALID NOTICE 1-2009 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
DLA MIL-PRF-32192/1 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), POSITIVE TEMPERATURE COEFFICIENT, STYLE RCTP0303
DLA DSCC-DWG-01033 REV B-2010 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
DLA MIL-PRF-32192/2 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), INSULATED POSITIVE TEMPERATURE COEFFICIENT STYLE RCTP0805
DLA A-A-55562 A-2001 RESISTOR, VOLTAGE SENSITIVE (VARISTOR, METAL OXIDE), CHIP
DLA A-A-55562 A VALID NOTICE 1-2006 RESISTOR, VOLTAGE SENSITIVE (VARISTOR, METAL OXIDE), CHIP
DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA DSCC-DWG-01033 REV A-2002 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA A-A-55562 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip
DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core

ECIA - Electronic Components Industry Association

EIA/IS-535BAAE-1998 Detail Specification for Low ESR Molded Tantalum Chip

American National Standards Institute （ANSI)

ANSI/IEEE 1450.6.1:2009 Standard for Describing On-Chip Scan Compression
ANSI/VITA 41.1-2006 VXS 4X InfiniBand Protocol

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD22-A100C-2007 Cycled Temperature-Humidity-Bias Life Test
JEDEC JESD22-A100D-2013 Cycled Temperature-Humidity-Bias Life Test
JEDEC JESD22-A101D-2015 Steady-State Temperature-Humidity Bias Life Test
JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull

Military Standards (MIL-STD)

MIL MIL-PRF-32192/3-2005 Resistor, Chip, Thermal (Thermistor), Negative Temperature Coefficient, Style RCTN0404
MIL MIL-PRF-32192/1-2005 Resistor, Chip, Thermal (Thermistor), Positive Temperature Coefficient, Style RCTP0303
MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE

International Organization for Standardization (ISO)

ISO 11093-2:1994 Paper and board - Testing of cores - Part 2: Conditioning of test samples
ISO 8756:1994 Air quality; handling of temperature, pressure and humidity data
ISO 1039:1995 Cinematography - Cores for motion-picture and magnetic film rolls - Dimensions

IPC - Association Connecting Electronics Industries

IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Indonesia Standards

SNI 01-4304-1996 Pineapples chips
SNI 01-4306-1996 Sweet potatoes chips

British Standards Institution (BSI)

BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
PAS 62177-2000 Highly-Accelerated Temperature and Humidity Stress Test (HAST) (Edition 1.0)
PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)
BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
BS EN IEC 63215-2:2023 Endurance test methods for die attach materials - Temperature cycling test method for die attach materials applied to discrete type power electronic devices
BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers

Gosstandart of Russia

GOST R ISO 8756-2005 Air quality. Handling of temperature, pressure and humidity data

German Institute for Standardization

DIN 4000-70:1992-01 Tabular layouts of article characteristics for core laminations, cores and coil formers for small transformers and chokes
DIN ISO 8756:1996 Air quality - Handling of temperature, pressure and humidity data (ISO 8756:1994)
DIN 15531:1976 Cores for motion-picture and magnetic film
DIN 4000-70:1992 Tabular layouts of article characteristics for core laminations, cores and coil formers for small transformers and chokes
DIN EN 62258-1:2011-04*VDE 0884-101:2011-04 Semiconductor die products

Magyar Szabványügyi Testület

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DANSK DS/EN IEC 63215-2:2023 Endurance test methods for die attach materials – Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)

VN-TCVN

TCVN 6752-2000 Air quality.Handling of temperature, pressure and humidity data

GCC Standardization Organization

GSO ISO 8756:2008 Air quality-Handling of temperature ,pressure and humidity data
BH GSO ISO 8756:2024 Air quality-Handling of temperature ,pressure and humidity data

Spanish Association for Standardization (UNE)

UNE 77233:1996 AIR QUALITY. HANDLING OF TEMPERATURE, PRESSURE AND HUMIDITY DATA.

Association Francaise de Normalisation

NF C93-745-2*NF EN IEC 63215-2:2023 Endurance test methods for die attach materials - Part 2 : temperature cycling test method for die attach materials applied to discrete type power electronic devices

The Directorate General of Specifications and Metrology (DGSM)

OS GSO ISO 8756:2008 Air quality-Handling of temperature ,pressure and humidity data

Swedish Institute for Standards

SS-ISO 8756:1997 Air quality - Handling of temperature, pressure and humidity data

TIA - Telecommunications Industry Association

J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

YU-JUS

JUS N.R8.153-1982 Cores for inductors and transformers for telecommunications. ethods of expressing temperature dependence

CZ-CSN

CSN 67 3219-1983 Oil varnísh for chips O 1109

U.S. Air Force

AIR FORCE MS27550-1967 STANDARD DATA BASE CHIP

Others: Temperature and humidity pressing chips