vertical half height
vertical half height, Total:111 items.
The international standard classification for "vertical half height" includes: Lathes , Aerospace electric equipment and systems , Semiconductor devices , Semiconductor devices in general .
The Chinese standard classification for "vertical half height" includes: Lathe , Furniture processing machinery , Technical management , Technical management , Technical management , Technical management , Semiconductor discrete devices in general , Technical Management , Technical management , Electronic components , Semiconductor triode , Container, tray and pallet .
Professional Standard - Machinery
- JB/T 8481-1996 Vertical type multiple spindle semi-automatic lathes Technical conditions
- JB/T 8481.1-1999 Vertical type multiple spindle semi-automatic lathes Accuracy inspection
工业和信息化部
- SJ/T 1480-2016 Semiconductor discrete device 3CG130 type silicon PNP high frequency low power transistor detailed specification
- JB/T 13581.1-2019 High-speed vertical machining centers-Part 1:Testing of the accuracy
- SJ/T 1472-2016 Semiconductor discrete device 3CG110 type silicon PNP high frequency low power transistor detailed specification
- JB/T 13581.2-2019 High-speed vertical machining centres-Part 2:Specifications
- JB/T 13440-2018 Vertical drum high gradient magnetic separator
- SJ/T 1477-2016 Semiconductor discrete device 3CG120 type silicon PNP high frequency low power transistor detailed specifications
- SJ/T 1486-2016 Semiconductor discrete device 3CG180 type silicon PNP high frequency high back voltage low power transistor detailed specification
Group Standards of the People's Republic of China
- T/CEEIA 284-2017 Specification for vertical high-temperature and high-pressure shielded electric pump(lower pump)
- T/CSEM 0004-2021 High anti-jamming stand-alone smoke detection alarm
- T/ZZB 1595-2020 High speed intelligent vertical laminating machine
- T/ZZB 1339-2019 High speed precision CNC vertical milling machine
- T/WLJC 119-2023 Precision Vertical Complex Grinder
Professional Standard - Light Industry
- QB/T 1592-1992 Vertical High-speed Single-axle Wood Milling Machine
Professional Standard - Electron
- SJ 20175-1992 Semiconductor discrete device - Detail specification for NPN silicon ultra-high frequency low-power transistor of Type 3DG918
- SJ/T 11848-2022 Semiconductor discrete device 3DG2484 type NPN silicon high frequency low power transistor detailed specifications
- SJ 20064-1992 Semiconductor discrete device.Detail specification for type QL71 Silicon single phase full wave bridge rectifier
- SJ 20059-1992 Semiconductor discrete device-Detail specification for silicon NPN high-frequency low power transistor of Type 3DG111
- SJ 50033/160-2002 Semiconductor discrete devices Detail specification for type 3DG122 silicon UHF low-power transistor
- SJ 50033/29-1994 Semiconductor discrete device-Detail specification for GaAs high-speed switching assembly for type EK20
- SJ 20066-1992 SJ 2006 6-1992 Semiconductor discrete device - Detail specification for Type 2CL3 silicon high voltage rectifier stack
- SJ 50033/67-1995 Semiconductor discrete device - Detail specification for Type 3DD103 high-voltage, low-frequency and high-power transistor
- SJ 50033/75-1995 Semiconductor discrete devices-Detail specification for Type 3DG135 silicon ultra high frequency low-power transistor
- SJ 50033/141-1999 Semiconductor discrete devices-Detail specification for Type 2EK150 GaAs high speed switching diode
- SJ 50033/61-1995 Semiconductor discrete device - Detail specification for Type 3DK6547 high-voltage and power switching transistor
- SJ 20060-1992 Semiconductor discrete device-Detail specification for silicon NPN high-frequency low power transistor of Type 3DG120
- SJ 50033/154-2002 Semiconductor discrete devices Detail specification for type 3DG251 silicon UHF low-noise transistor
- SJ 50033/95-1995 Semiconductor discrete devices-Detail specification for Type 3DG144 NPN silicon high-frequency low-noise low-power transistor
- SJ 50033/73-1995 Semiconductor discrete device Detail specification for type QL74 silicon single phase bridge rectifier
- SJ/T 11849-2022 Detailed specifications for semiconductor discrete devices 3DG3500 and 3DG3501 type NPN silicon high-frequency low-power transistors
- SJ 50033/103-1996 Semiconductor discrete devices - Detail specification for Type 3DA89 high-frequency power transistor
- SJ 50033.50-1994 Semiconductor discrete device-Detail specification for type QL73 silicon three phase full wave bridge rectifier
- SJ 50033/159-2002 Semiconductor discrete devices Detail specification for type 3DG142 silicon UHF low-noise transistor
- SJ 50033/62-1995 Semiconductor discrete device - Detail specification for Type 3DK406 high-voltage and power switching transistor
- SJ 50033/158-2002 Semiconductor discrete devices Detail specification for type 3DG44 silicon UHF low-noise transistor
- SJ/T 11089-1996 Letter symbols for discrete semiconductor components
- SJ 20065-1992 Semiconductor discrete device-Detail specification for Type QL72 silicon three phase full wave bridge rectifier
- SJ 50033/93-1995 Semiconductor discrete devices - Detail specification for Type 3DG142 NPN silicon high-frequency low-noise low-power transistor
- SJ 50033/1-1994 Semiconductor discrete device-Detail specification for type 3DA150 high frequency and power transistor
Military Standard of the People's Republic of China-General Armament Department
- GJB 33-1985 General Specification for Semiconductor Discrete Devices
- GJB/Z 10-1989 Semiconductor discrete device series type spectrum
- GJB 33/14A-2021 Semiconductor discrete device 3DG44 type silicon ultra-high frequency low noise transistor detailed specification
- GJB 33B-2021 General Specification for Semiconductor Discrete Devices
- GJB 33/001-1989 Blank detailed specification for high frequency low power transistors for semiconductor discrete devices
- GJB 128-1986 Aerial photographic specification for military topographic mapping
- GJB 3164-1998 Semiconductor discrete device packaging specifications
- GJB 33/5A-2021 Detailed specifications for semiconductor discrete devices 2CL59K, 2CL60K, 2CL80K, and 2CL150K silicon high-voltage rectifier stacks
- GJB 33A/14-2003 Semiconductor discrete device 3DG44 type silicon ultra-high frequency low noise transistor detailed specification
- GJB 128B-2021 Semiconductor discrete device test methods
- GJB 33/4A-2021 Detailed specifications for semiconductor discrete devices QL12300A, QL12300D and QL12300H type silicon single-phase bridge rectifiers
Professional Standard - Aerospace
- QJ 10007/11-2008 Detail specification for 3DG182 type silicon high-frequency low-power high-backvoltage transistors for semiconductor discrete devices used in aerospace
- QJ 1511A-1998 Semiconductor Discrete Devices - Specifications for Acceptance
未注明发布机构
- GJB 9785-2020 Specification for vertical piston high-pressure air compressors for ships
- GJB 128A-1997 Semiconductor discrete device test methods
- GJB 33A-1997 General Specification for Semiconductor Discrete Devices
工业和信息化部/国家能源局
- JB/T 13083.2-2017 High-speed numerical control vertical band sawing machine- Part 2:Specifications
- JB/T 13083.1-2017 Hiigh-speed numerical control vertical band sawing machine-Part 1:Testing of the accuracy
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 7581-1987 of outlines for semiconductor discrete devices
- GB/T 18832-2002 Box pallet and post pallet
- GB/T 11499-2001 Letter symbols for discrete semiconductor devices
Professional Standard - Goods and Materials
- WB/T 1127-2022 Box pallet and post pallet
YU-JUS
- JUS M.Z3.034-1980 Vertical steel tanks, for semi-embedded aboveground storage o) minerahoih
U.S. Military Regulations and Norms
- ARMY A-A-52613 A-2010 SEMITRAILER, REFUSE COLLECTION: TANDEM AXLE, 57 CUBIC METERS (75 CUBIC YARD), FOR USE WITH STATIONARY COMPACTORS AND COMPACTOR, STATIONARY, 2.7 CUBIC METERS (3.5 CUBIC YARD), FOR USE WITH REFUSE COLLECTION SEMITRAILERS
- ARMY MIL-S-62359 VALID NOTICE 1-1989 SEMITRAILER, BOTTOM DUMP: 18 TO 22 CUBIC YARD CAPACITY, COMMERCIAL
- ARMY MIL-S-62359 NOTICE 2-1996 SEMITRAILER, BOTTOM DUMP: 18 TO 22 CUBIC YARD CAPACITY, COMMERCIAL
- ARMY MIL-S-62359-1983 SEMITRAILER, BOTTOM DUMP: 18 TO 22 CUBIC YARD CAPACITY, COMMERCIAL
- ARMY A-A-52033 A VALID NOTICE 1-2008 Container, Cargo, Open-Top, Half Height
RU-GOST R
- GOST 18139-1972 Multi-spindle chuck vertical semiautomatic lathes. Basic dimensions
- GOST 6820-1975 Semiautomatic multi-spindle vertical chucking lathes standards of accuracy
- GOST 16025-1991 Semiautomatic vertical broaching machines. Basic parameters and dimensions. Standards of accuracy and rigidity
ETSI - European Telecommunications Standards Institute
- TS 103 589-2018 Higher Order Ambisonics (HOA) Transport Format (V1.1.1)
SCC
- ETSI TS 103 589-2018 Higher Order Ambisonics (HOA) Transport Format
- MIL MIL-S-62292B-1993 SEMITRAILER,REFUSE COLLECTION:TEM AXLE,57 CUBIC METERS (75 CUBIC YARD), FOR USE WITH STATIONARY COMPACTORS , COMPACTOR,STATIONARY,2.7 CUBIC METERS (3.5 CUBIC YARD), FOR USE WITH REFUSE COLLECTION SEMITRAILERS (SUPERSEDING MIL-S-62292A)
- CAN/CSA-C22.2 No.61029-2-8-2006(C2011) Safety of semi-stationary electric machine tools — Part 2: Particular rules for vertical single-spindle routers
- DANSK DS/EN 153000:1999 General specification: Discrete pressure contact power semiconductor devices (Qualification approval)
IT-UNI
- UNI 5554-1965 High-speed hand press vertical drilling machine. Glossary
- UNI 7968-1979 Test conditions for machine tools. Turret or single spindle co-ordinate drilling machines with vertical spindle.
IN-BIS
- IS 13640-1993 General introduction for milling machines with table of fixed height, with horizontal lkor vertical spindle
International Electrotechnical Commission (IEC)
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
GOST
- GOST R 70022-2022 Opening elements of light-transparent structural constructions. General specifications
- GOST R 70113-2022 Radius concave еndmilling catters. Base dimensions
European Committee for Electrotechnical Standardization(CENELEC)
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
CENELEC - European Committee for Electrotechnical Standardization
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
Association Francaise de Normalisation
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF EN 61029-2-8:2010 Sécurité des machines-outils électriques semi-fixes - Partie 2-8 : règles particulières pour les toupies monobroches verticales
- NF ISO 3686-1:2000 Test conditions for high-precision coordinate single-spindle vertical drilling and boring machines with fixed height table - Accuracy check - Part 1: single-post machines
Lithuanian Standards Office
- LST EN 153000-2001 Generic specification. Discrete pressure contact power semiconductor devices (Qualification approval)
International Organization for Standardization (ISO)
- ISO 2773:2023 Test conditions for pillar type vertical drilling machines
- ISO/FDIS 2773:2018 Test conditions for pillar type vertical drilling machines — Testing of the accuracy
- ISO 2773:2024 Test conditions for pillar type vertical drilling machines — Testing of accuracy
- ISO/DIS 2773 Test conditions for pillar type vertical drilling machines — Testing of the accuracy
British Standards Institution (BSI)
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS 6493-1.1:1984 Semiconductor devices - Part 1: Discrete devices - Section 1.1 General
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
TH-TISI
- TIS 1863-2009 Semiconductor devices.discrete devices
- TIS 1125-1992 Standard for vertical/inclined pumps
Danish Standards Foundation
- DS/EN 153000:1999 General specification: Discrete pressure contact power semiconductor devices (Qualification approval)
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60747-11-2002(2022) Discrete semiconductor devices-Part 11:Sectional specification for discrete devices
- KS C IEC 60747-11-2002(2017) Discrete semiconductor devices-Part 11:Sectional specification for discrete devices
- KS C IEC 60747-11-2022 Discrete semiconductor devices-Part 11:Sectional specification for discrete devices
- KS T 2011-2006 Post pallet
ES-AENOR
- UNE 20-700 Pt.11-1991 Semiconductor devices. Part 11:Sectional specification for discrete devices
GOSTR
- GOST R 59067-2020 Trunk pipeline transport of oil and oil products. Vertical semi-submersible pumps. General specifications
SE-SIS
- SIS SS CECC 50000-1987 Generic specification: Discrete semiconductor devices
Japanese Industrial Standards Committee (JISC)
- JIS Z 0616:1991 Post pallets
- JIS B 4622:1975 Leg vices
Association of German Mechanical Engineers
- VDI 2324-2001 Vertical bucket elevators
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