active chip

active chip, Total:102 items.

The international standard classification for "active chip" includes: Microbiology in general , General methods of tests and analysis for food products , Biology. Botany. Zoology , Laboratory medicine , Motion picture films. Cartridges , Boilers and heat exchangers .

The Chinese standard classification for "active chip" includes: Medical laboratory equipment , Basic standards and general methods , Basic Subject in general , Medical apparatus and devices in general , Photosensitive material , Heat-exchange equipment , Daily-use hardware .

Group Standards of the People's Republic of China

T/SBX 021-2019 Operation rules for automatic scribing and splitting of laser chips
T/CASME 572-2023 （AEC-Q100 Qualified）Vehicle regulation level power management chip
T/ZACA 031-2020 Rapid detection of pathogens in food — Microfluidic chip method
T/ZZB Q031-2020 Rapid detection of pathogens in food — Microfluidic chip method

Professional Standard - Commodity Inspection

SN/T 1543-2005 GeneChip methods for identification of foodborne pathogens

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

GB/T 35535-2017 Detection of genetically modified components in soybean and canola―Membrane-based gene-chip method
GB/T 35917-2018 Rapid detection for animal-derived materials—Membrane-based array method
GB/T 33752-2017 Aldehyde slide for microarrays

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 6848-1986 Dimensions of the cores for motion-picture film rolls
GB/T 9082.2-2011 Heat pipes with wick inside

Professional Standard - Medicine

YY/T 1152-2009 Aldehyde slide for biochips

Professional Standard - Light Industry

QB/T 2475-2000 Blade Cored Door Lock

Professional Standard - Electron

SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources

未注明发布机构

JEDEC JESD49B.01-2023 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD)

Defense Logistics Agency

DLA SMD-5962-89805 REV A-2002 MICROCIRCUIT, LINEAR, RMS-TO-DC CONVERTER, MONOLITHIC SILICON
DLA SMD-5962-89637 REV B-2004 MICROCIRCUIT, LINEAR, WIDEBAND RMS-TO-DC CONVERTER, MONOLITHIC SILICON
DLA DSCC-DWG-87018 REV G-2002 RESISTOR NETWORKS, 16 PIN, LEADLESS CHIP CARRIER
DLA DSCC-DWG-01033 REV A-2002 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
DLA A-A-59235 VALID NOTICE 1-2011 Coil, RF, Chip, Fixed, Power, Magnetically Shielded, Surface Mount
DLA MIL-PRF-83446/21 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/24 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Iron Core
DLA MIL-PRF-83446/20 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/23 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Phenolic Core
DLA MIL-PRF-83446/25 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/30 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core
DLA MIL-PRF-83446/22 A VALID NOTICE 1-2011 Coils, Radio Frequency, Chip, Fixed, Ferrite Core

British Standards Institution (BSI)

BS EN IEC 62148-19:2019 Fibre optic active components and devices. Package and interface standards - Photonic chip scale package
BS EN IEC 62149-11:2020 Fibre optic active components and devices. Performance standards - Multiple channel transmitter/receiver chip scale package with multimode fibre interface
17/30361915 DC BS EN 62149-11. Fibre optic active components and devices. Performance standards. Part 11. Multiple channel transmitter/receiver chip scale package with multimode fibre interface
18/30387974 DC BS EN IEC 62149-11. Fibre optic active components and devices. Performance standards. Part 11. Multiple channel transmitter/receiver chip scale package with multimode fibre interface

Association Francaise de Normalisation

NF EN IEC 62148-19:2019 Fibronic active components and devices - Package and interface standards - Part 19: photonic chip package
NF C93-883-19*NF EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19 : photonic chip scale package
NF EN IEC 62149-11:2020 Fibronic active components and devices - Performance standards - Part 11: multi-channel transmitter/receiver chip package with multi-modal fiber interface
NF C93-884-11*NF EN IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11 : multiple channel transmitter/receiver chip scale package with multimode fibre interface
NF C93-339:2005 Ferrite cores (ETD-cores) intended for use in power supply applications - Dimensions.

SCC

DANSK DS/EN IEC 62148-19:2019 Fibre optic active components and devices – Package and interface standards – Part 19: Photonic chip scale package
CEI EN IEC 62148-19:2019 Fiber optic active components and devices - Package and interface standards Part 19: Photonic chip scale package
DANSK DS/EN 59008-5-2:2001 Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures
MIL MIL-PRF-83446/21A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/32A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
MIL MIL-PRF-83446/29-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, IRON CORE
CEI EN IEC 62149-11:2021 Fibre optic active components and devices - Performance standards Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface
BS PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types-Minimally-packaged die
MIL MIL-PRF-83446/28-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
DIN EN 62148-19 E:2016 Draft Document - Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package (IEC 86C/1383/NP:2016)
MIL MIL-PRF-83446/23A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
MIL MIL-PRF-83446/31-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, PHENOLIC CORE
BS PD IEC/TR 62258-4:2007 Semiconductor die products-Questionnaire for die users and suppliers
CEI EN 62258-6:2007 Semiconductor die products Part 6: Requirements for information concerning thermal simulation
MIL MIL-PRF-83446/30A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33A-2005 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
DANSK DS/EN 62258-6:2007 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
MIL MIL-PRF-83446/30-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/22A-2006 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE
MIL MIL-PRF-83446/33-2000 COILS, RADIO FREQUENCY, CHIP, FIXED, FERRITE CORE

International Electrotechnical Commission (IEC)

IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

German Institute for Standardization

DIN EN IEC 62148-19:2020-07 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package (IEC 62148-19:2019); German version EN IEC 62148-19:2019
DIN 15531:1976 Cores for motion-picture and magnetic film
DIN EN 62149-11:2017 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface (IEC 86C/1471/CD:2017)
DIN EN 62258-6:2007-02 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).

ES-UNE

UNE-EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package (Endorsed by Asociación Española de Normalización in September of 2019.)
UNE-EN IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface (Endorsed by Asociación Española de Normalización in July of 2020.)
UNE-EN 62258-6:2006 Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation(IEC 62258-6:2006) (Endorsed by AENOR in January of 2007.)

European Committee for Electrotechnical Standardization（CENELEC）

EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
EN IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

ECIA - Electronic Components Industry Association

EIA-800-1999 Integrated Passive Device (IPD) Chipscale Package Design Guidelines
EIA/ECA-961-2005 Qualification Specification for Die Level Networks with Solder Bump Interconnects

IPC - Association Connecting Electronics Industries

IPC J-STD-013 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012 CD-1996 Implementation of Flip Chip and Chip Scale Technology
IPC J-STD-012-1996 Implementation of Flip Chip and Chip Scale Technology
IPC/EIA J-STD-028 CD-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC/EIA J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps
IPC J-STD-027 CD-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC DD-135 CD-1995 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC 2225 CD-1998 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Electronic Components, Assemblies and Materials Association

EIA_ECA-961-2005 QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS

Indonesia Standards

SNI 01-4306-1996 Sweet potatoes chips
SNI 01-4304-1996 Pineapples chips

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

IPC DD-135-1995 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
IPC J-STD-027-2003 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC 2225-1998 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC SMC-WP-003-1993 Chip Mounting Technology (CMT)

CENELEC - European Committee for Electrotechnical Standardization

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die

US-FCR

FCR VA 09 67 23.20-2011 RESINOUS (EPOXY BASE) WITH VINYL CHIP BROADCAST (RES-2)

HU-MSZT

MSZ 14593/4-1979 Dissolving cores for road vehicles, tablet dissolving cores (dissolving tablets)

Danish Standards Foundation

DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die

CZ-CSN

CSN 04 2147-1962 Core rods, pointed

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull

IEC - International Electrotechnical Commission

PAS 62084-1998 Implementation of Flip Chip and Chip Scale Technology (Edition 1.0; No Replacement)

GSO

OS GSO IEC 62258-6:2014 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

American National Standards Institute （ANSI)

ANSI/VITA 41.1-2006 VXS 4X InfiniBand Protocol

TIA - Telecommunications Industry Association

J-STD-028-1999 Performance Standard for Construction of Flip Chip and Chip Scale Bumps (IPC/EIA J-STD-028)

PL-PKN

PN-EN IEC 62149-11-2021-01 E Fibre optic active components and devices -- Performance standards -- Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface (IEC 62149-11:2020)

VDE - VDE Verlag GmbH@ Berlin@ Germany

VDE 0886-149-11-2017 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter eceiver chip scale package with multimode fibre interface (IEC 86C/1471/CD:2017)