UV gap semiconductor
UV gap semiconductor, Total:100 items.
The international standard classification for "UV gap semiconductor" includes: Optics and optical measurements , Integrated circuits. Microelectronics , Semiconductor devices .
The Chinese standard classification for "UV gap semiconductor" includes: Technical management , Inorganic chemicals in general , Microcircuit in general , Semiconductor triode , Power semiconductor device and parts .
Professional Standard - Electron
- SJ 2750-1987 Outline dimensions for semiconductor laser diodes
- SJ/T 11818.3-2022 Semiconductor UV-emitting diodes Part 3: Device Specifications
- SJ/T 11818.1-2022 Semiconductor UV-emitting diodes Part 1: Test methods
- SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
- SJ 2684-1986 Physical demensions for light emitting device of semiconductor
- SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
- GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 37131-2018e Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
- GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
- GB/T 7581-1987 of outlines for semiconductor discrete devices
- GB/T 37131-2018(英文版) Nanotechnology - Testing method of UV-visible diffuse reflectance spectrum of semiconductor nanopowder materials
机械工业部
- JB/T 6306-1992 Power semiconductor module dimensions
Military Standard of the People's Republic of China-General Armament Department
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures
- GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
- GJB 923A-2004 General specification for packages of semiconductor discrete devices
- GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
Professional Standard - Machinery
- JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
- JB/T 5631-1991 Epitaxial Furnace for Semiconductor Devices. Energy Efficiency Standard
Association Francaise de Normalisation
- NF ISO 10677:2011 Céramiques techniques - Sources lumineuses UV destinée aux essais des matériaux photocatalytiques semi-conducteurs
- NF C80-204*NF EN 62418:2011 Semiconductor devices - Metallization stress void test
- NF B44-103*NF ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics) - Ultraviolet light source for testing semiconducting photocatalytic materials
- NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
British Standards Institution (BSI)
- BS EN 62418:2010 Semiconductor devices. Metallization stress void test
- BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
- 19/30390371 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
- BS ISO 10677:2011 Fine ceramics (advanced ceramics, advanced technical ceramics). Ultraviolet light source for testing semiconducting photocatalytic materials
- 18/30362458 DC BS IEC 60747-14-11. Semiconductor devices. Part 14-11. Semiconductor sensors. Test method of surface acoustic wave based integrated sensor for measuring ultra violet, illumination and temperature
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
International Electrotechnical Commission (IEC)
- IEC 62418:2010 Semiconductor devices - Metallization stress void test
- IEC 60747-14-11:2021 Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
Korean Agency for Technology and Standards (KATS)
- KS D 2717-2008(2018) Evaluation of metallic/semiconducting ratio of single-walled carbon nanotube soots using UV-VIS－NIR absorption spectroscopy
Defense Logistics Agency
- DLA SMD-5962-88635 REV A-1993 MICROCIRCUIT, DIGITAL, CMOS UV ERASABLE, PROGRAMMABLE LOGIC DEVICE
- DLA SMD-5962-93144 REV B-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABLE PROGRAMMABLE, LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-94510 REV A-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASEABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88549 REV A-1992 MICROCIRCUIT, DIGITAL, CMOS, UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-90989 REV A-2006 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-91772-1993 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-93248-1993 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88548 REV A-1992 MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON
- DLA SMD-5962-88678 REV B-2005 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88726 REV E-2007 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ULTRAVIOLET ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
- DLA SMD-5962-88724 REV D-2007 MICROCIRCUIT, DIGITAL, MEMORY, CMOS UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
KR-KS
- KS L ISO 10677-2023 Fine ceramics (advanced ceramics, advanced technical ceramics) — Ultraviolet light source for testing semiconducting photocatalytic materials
GSO
- OS GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
- GSO ISO 10677:2015 Fine ceramics (advanced ceramics, advanced technical ceramics) -- Ultraviolet light source for testing semiconducting photocatalytic materials
IN-BIS
- IS 5000 OD.11-1971 Semiconductor device size device outline OD11
- IS 5000 OB.4-1969 Basic overall dimensions of semiconductor devices OB4
- IS 5000 OB.7-1969 Basic overall dimensions of semiconductor devices OB7
- IS 5000 OD.2-1969 Semiconductor device size device outline OD2
- IS 5000 OD.16-1973 Semiconductor device size device outline OD16
- IS 5000 OD.4-1969 Semiconductor device size device outline OD4
- IS 5000 OB.1-1969 Basic overall dimensions of semiconductor devices OB1
- IS 5000 OD.1-1969 Semiconductor device size device outline OD1
- IS 5000 OD.6-1969 Semiconductor device size device outline OD6
- IS 5000 OD.13-1971 Semiconductor device size device outline OD13
- IS 5000 OD.18-1974 Semiconductor device size device outline OD18
- IS 5000 OB.2-1969 Basic overall dimensions of semiconductor devices OB2
- IS 5000 OD.19-1974 Semiconductor device size device outline OD19
- IS 5000 OB.6-1969 Basic overall dimensions of semiconductor devices OB6
- IS 5000 OD.14-1971 Semiconductor device size device outline OD14
- IS 5000 OD.15-1973 Semiconductor device size device outline OD15
- IS 5000 OD.8-1969 Semiconductor device size device outline OD8
- IS 5000 OB.5-1969 Basic dimensions of semiconductor devices OB5
- IS 5000 OD.35-1981 Semiconductor device size device outline OD35
- IS 5000 OD.31-1981 Semiconductor device size device outline OD31
- IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
- IS 5000 OD.9-1969 Semiconductor device size device outline OD9
- IS 5000 OD.30-1981 Semiconductor device size device outline OD30
- IS 5000 OD.7-1969 Semiconductor device size device outline OD7
- IS 5000 OD.12-1971 Semiconductor device size device outline OD12
- IS 5000 OD.17-1974 Semiconductor device size device outline OD17
- IS 5000 OD.5-1969 Semiconductor device size device outline OD5
- IS 5000 OD.33-1981 Semiconductor device size device outline OD33
- IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
- IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
- IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
- IS 5000 OD.28-1978 Semiconductor device size device outline OD 28
- IS 5000 OD.26-1978 Semiconductor device size device outline OD 26
- IS 5000 OD.22-1978 Semiconductor device size device outline OD 22
- IS 5000 OD.20-1978 Semiconductor device size device outline OD 20
- IS 5000 OD.29-1979 Semiconductor Device Dimensions Device Outline OD 29
- IS 5000 OD.27-1978 Semiconductor Device Dimensions Device Outline OD 27
- IS 5000 OD.23-1978 Semiconductor device size device outline OD 23
- IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
- IS 5000 OD.37-1982 Semiconductor device size device outline size OD 37
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
PL-PKN
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
SCC
- BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
- BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
- BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
- AWWA WQTC62577 Analyzing UV Reactor Validation Data to Verify UV Dose Delivery Using the UV Disinfection Guidance Manual
German Institute for Standardization
- DIN 41885:1976 Cases type 101 for semiconductor devices; main dimensions
- DIN 41877:1971 Case 6 A 3 for semiconductor devices; main dimensions
ABS - American Bureau of Shipping
- ABS 249-2017 GUIDANCE NOTES ON AIR GAP ANALYSIS FOR SEMI-SUBMERSIBLES
CZ-CSN
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
RU-GOST R
- GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions
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