Conductors and Electrical Appliances
Conductors and Electrical Appliances, Total:289 items.
The international standard classification for "Conductors and Electrical Appliances" includes: Power stations in general , Rectifiers. Convertors. Stabilized power supply , Other methods of testing of metals , Semiconductor devices , Electrical engineering (Vocabularies) , Cryogenic vessels , Other semiconductor devices , Integrated circuits. Microelectronics , Semiconductor devices in general , Plug-and-socket devices. Connectors , Measurement of force, weight and pressure , Other electromechanical components , Optoelectronics. Laser equipment , Other electrical accessories .
The Chinese standard classification for "Conductors and Electrical Appliances" includes: Power transmission and transformation engineering , Power semiconductor device and parts , Basic standards and general methods , Semiconductor integrated circuit , Packaging material and container , Microcircuit in general , Optoelectronic device assembly , Technical management , Technical management , Technical management , Technical management , Transformer , Industrial automation and control device in general , Laser device .
Taiwan Provincial Standard of the People's Republic of China
- CNS 7011-1981 Numbering of Electrodes in Multiple Electrode Semiconductor Devices and Designation of Units in Multiple Unit Semiconductor Devices
- CNS 11816-1987 Markings and Arrangements of Mainconnections and Small-Wiring for Marine Use
- CNS 11900-1987 Fixed Ceramic Capacitors for Electronic Equipment (Semiconductor)
- CNS 11794-1986 Minimum Length Between the Cable Entrances and the Terminals of Electric Machinery and Equipment for Marine Use
Professional Standard - Electricity
- DL/T 2602-2023 Selection and test guidelines for protective apparatus of electric DC power system
- DL/T 5222-2021 Code for design of the conductor and electrical equipment selection
- DL/T 2269-2021 Guide to determining of replacement and reuse for distribution transformer
- DL/T 2000-2019 Guide for on-site united partial discharge measurement for 1000kV main transformer with voltage regulating and compensating transformer
- DL/T 5222-2005 Design technical rule for selecting conductor and electrical equi
- DL/T 1560-2016 Guidelines of onsite assembly and test for disassembly transportation power transformer
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 2900.32-1994 Electrotechnical terminology - Power semiconductor device
- GB/T 13422-2013 Semiconductor converters—Electrical test methods
- GB/T 31481-2015 Guidance for gas/materials compatibility of cryogenic vessels
- GB 7085-1986 Detail specification for electronic component--Semiconductor integrated circuit--CJ0450 Dual peripheral positive AND drivers
- GB/T 8446.1-1987 Heat sink for power semiconductor device
- GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
- GB/T 10236-1988 Guide for evaluation of interference effects and compatibility technology between semiconductor convertors and power supply systen
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 13422-1992 Power semiconductor converters-Electrical test methods
- GB/T 31522-2015 Matrix to superconductor volume ratio measurement―Copper to non-copper volume ratio of Nb 3Sn composite superconducting wires
- GB/T 17950-2000 Semiconductor converter - Part 6: Application guide for the protection of semiconductor converters against overcurrent by fuses
- GB/T 2900.66-2004 Electrotechnical terminology - Semiconductor devices and integrated circuits
- GB/T 32817-2016 Semiconductor devices - Micro-electromechanical devices - Generic specification for MEMS
- GB/T 15651.5-2024 Semiconductor devices—Part 5-5: Optoelectronic devices—Photocouplers
- GB/T 3859.3-1993 Semiconductor convertors—Transformers and reactors
- GB/T 10236-2006 Guide for compatibility and protection of interference effects between semiconductor convertors and power supply system
- GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer
- GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier
Professional Standard - Hydroelectric Power
- SDGJ 14-1986 Design technical regulations for selecting conductor and electrical equipment
Military Standard of the People's Republic of China-General Armament Department
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 5018-2001 General requirements for screening and acceptance of semiconductor optoelectronic devices
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 597/2A-1994 Detailed specifications for semiconductor integrated circuit CMOS AND gates and NAND gates
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB 8119-2013 General specification for semiconductor optoelectronic device
- GJB 9793-2020 Specification for surface-coated core-shell powders for conductive and electromagnetic shielding purposes
- GJB/Z 42.3-1993 Military microcircuit series type spectrum semiconductor integrated circuit microcomputer and memory integrated circuit
Professional Standard - Electron
- SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
- SJ/T 2215-2015 Measuring methods for semiconductor photocouplers
- SJ/T 10824-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2010 HTL Quad 2-input positive-NAND gate
- SJ/T 10820-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2001 HTL dual 4-input positive-NAND gate
- SJ/T 10822-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2008 HTL dual 4-input positive-NAND gate
- SJ/T 10828-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0452 HTL dual peripheral positive NAND drivers
- SJ/T 10849-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10121 ECL4-channel 3-3-3-3 input AND-OR/OR-NAND gate (Applicable for certification)
- SJ 50597.3-1994 Detail specification for types JH009 and JH2010 HTL NAND gate of semiconductor integrated circuits
- SJ/T 10848-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CE10117 ECL dual 2-channel 2-3-input AND-OR/OR-NAND gate (Applicable for certification)
- SJ 2555-1984 Technical guidelines designing and applications of shock and vibration isolators for equipment electronic
- SJ/T 10826-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0450 HTL dual peripheral positive AND drivers
- SJ/T 10816-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1040 TTL dual 4-input positive-NAND buffer (Applicable for certification)
- SJ/T 10823-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2009 HTL triple 3-input positive-NAND gate
- SJ/T 10042-1991 Detail specification for electronic components.Semiconductor integrated circuit.CT54LS00/CT74LS00 quadruple 2-input positive-NAND gate
- SJ/T 10827-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CJ0451 HTL dual peripheral positive AND drivers
- SJ/T 10815-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1030 TTL8 input positive-NAND gate (Applicable for certification)
- SJ/T 10084-1991 Detail specification for electronic components. Semiconductor integrated circuit CT54H20/CT74H20 dual 4-input positive-NAND gate
Professional Standard - Aerospace
- QJ 3297-2008 General Specification for Distributors of Missle and Launch Vehicle
- QJ 3092-1999 Detailed Specifications for Semiconductor Integrated Circuit HCT or Gate or Not Gate
Professional Standard - Machinery
- JB/T 7483-1994 Semiconductor resistance strain sensor
- JB/T 10097-2000 Case for power semiconductor device
- JB/T 10096-1999 Selection Guidance of Case for Power Semiconductor Device
- JB/T 7061-1993 Silicon Wafers Intended to Be Used in Power Semiconductor Devices
- JB/T 10501-2005 Ceramic parts of case for power semiconductor devices
- JB/T 9684-2000 Selecting guide of heat sink for power semiconductor device
- JB/T 8757-1998 Hot Pipe Radiators Intended to be Used in Power Semiconductor Devices
- JB/T 5844-1991 Directional relays and power relays with two input energizing quantities (IEC 60255-12: 1980 NEQ)
- JB/T 5843-2005 Connectors for power semiconductor devices
- JB/T 9687.2-1999 Tungsten disk for power semiconductor devices
- JB/T 4277-1996 Packing of Power Semiconductor Parts
- JB/T 7063-1993 Rated Voltage and Current of Power Semiconductor Devices
- JB/T 5843-1991 Connectors for Power Semiconductor Devices
- JB/T 10096-2000 Selection guidance of case for power semiconductor device
- JB/T 7483-2005 Semiconductor resistance strain gauge force stransducer/sensor
- JB/T 10097-1999 Cases for Power Semiconductor Devices
- JB/T 9687.1-1999 Molybdenum Disk for Power Semiconductor Devices
- JB/T 9644-1999 Reactor for semiconductor electric drive
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
国家机械工业局
- JB 9644-1999 Reactor for semiconductor electric transmission
未注明发布机构
- DIN 41772 Beiblatt 2:1979 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for equipment operating in parallel with batteries
Group Standards of the People's Republic of China
- T/CEEIA 301-2018 The selection and use of guidelines of low-voltage device for isolation and fuses
- T/CSEE 0157-2020 Guidelines for Operation and Maintenance of 1000kV Transformers in Power Plants
机械电子工业部
- JB 5843-1991 Connectors for power semiconductor devices
国家市场监督管理总局、中国国家标准化管理委员会
- GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
Professional Standard - Building Materials
- JC/T 2778-2023 Test method for conductivity of solid electrolyte for gas sensors
SCC
- BS IEC 60747-7:2000 Discrete semiconductor devices and integrated circuits-Bipolar transistors
- DIN IEC 60747-10:1987 Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
- BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
- UNE-EN 61788-5:2002 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors.
- CEI EN 61788-5:2014 Superconductivity Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- BS PD CEN ISO/TR 9241-308:2015 Ergonomics of human-system interaction-Surface-conducting electron-emitter displays (SED)
- DANSK DS/EN 61788-5:2013 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- AENOR UNE-EN 61788-5:2002 Superconductivity. Part 5: Measurement of the ratio between matrix and superconductor volumes. Relationship between copper and superconductor volumes of Cu/Nb-Ti composite superconductors.
- BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
- BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
- DANSK DS/EN 61788-12:2013 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- CEI EN 61788-12:2014 Superconductivity Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- DIN EN 61788-5 E:2011 Draft Document - Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductor (IEC 90/272/CD:2011)
- UNE-EN 61788-12:2004 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- CEI EN 62047-15:2016 Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
- BS EN 60747-5-5:2011+A1:2015 Semiconductor devices. Discrete devices-Optoelectronic devices. Photocouplers
- DANSK DS/EN 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
- CEI EN 62047-15/AB:2016 Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
- AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors
- AENOR UNE-EN 61788-12:2004 Superconductivity. Part 12: Measurement of the ratio between matrix and superconductor volumes. Relationship between volumes of copper and the rest of the superconducting wires composed of Nb3Sn.
- DANSK DS/EN IEC 60747-5-5:2020 Semiconductor devices – Part 5-5: Optoelectronic devices – Photocouplers
- CEI EN IEC 60747-5-5:2021 Semiconductor devices Part 5-5: Optoelectronic devices - Photocouplers
- CEI EN 62415:2011 Semiconductor devices - Constant current electromigration test
- DANSK DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
- CEI EN IEC 63244-1:2022 Semiconductor devices - Semiconductor devices for wireless power transfer and charging Part 1: General requirements and specifications
- CSA C57-1998(R2015) Electric Power Connectors for Use in Overhead Line Conductors
- DANSK DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
- BS 3363:1961 Schedule of letter symbols for light-current semiconductor devices
- DANSK DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- MIL MIL-DTL-24231/19E-2013 Connector, Single Cable, Type III, 65-Conductor
- CEI EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compasses
- AS 2547.1.5:1986 Semiconductor devices, Part 1.5: Discrete devices - Optoelectronic devices
- DIN EN 61788-12 E:2011 Draft Document - Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb<(Index)3>Sn composite superconducting wires; (IEC 90/273/CD:2011)
British Standards Institution (BSI)
- BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
- BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
- BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
- BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
- BS EN IEC 60747-5-5:2020 Semiconductor devices. Optoelectronic devices. Photocouplers
- BS IEC 62951-4:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
- BS IEC 62951-6:2019 Semiconductor devices. Flexible and stretchable semiconductor devices - Test method for sheet resistance of flexible conducting films
- BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
- BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
- BS DD IEC/PAS 61338-1-5:2010 Waveguide type dielectric resonators - General information and test conditions - Measurement method of conductivity at interface between conductor layer and dielectric substrate at microwave frequency
- BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
- BS EN 61338-1-5:2015 Waveguide type dielectric resonators. General information and test conditions. Measurement method of conductivity at interface between conductor layer and dielectric substrate at microwave frequency
- BS EN 60747-5-5:2011 Semiconductor devices. Discrete devices. Optoelectronic devices. Photocouplers
- 19/30404095 DC BS EN IEC 60747-5-4. Semiconductor devices. Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS EN 61788-4:2016 Superconductivity. Residual resistance ratio measurement. Residual resistance ratio of Nb-Ti and Nb3Sn composite superconductors
- BS EN 61788-5:2013 Superconductivity. Matrix to superconductor volume ratio measurement. Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- BS EN 61788-5:2001 Superconductivity - Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- BS EN 61788-5:2003 Superconductivity - Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- BS EN 61788-12:2013 Superconductivity. Matrix to superconductor volume ratio measurement. Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- 13/30264600 DC BS EN 60747-14-8. Semiconductor devices. Part 14-8. Semiconductor sensors. Capacitive degradation sensor of liquid
- BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS 6493-2.1:1985 Semiconductor devices - Integrated circuits - General
- 23/30473272 DC BS IEC 60747-5-4 AMD 1. Semiconductor devices - Part 5-4. Optoelectronic devices. Semiconductor lasers
- BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
- BS EN 61788-12:2003 Superconductivity - Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- BS EN IEC 62969-1:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
- BS EN 61788-12:2002 Superconductivity - Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- BS EN 60747-16-1:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Amplifiers
- BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
- BS EN IEC 63244-1:2021 Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
- BS EN IEC 60747-16-6:2019 Semiconductor devices. Microwave integrated circuits. Frequency multipliers
- BS EN 60747-16-3:2002+A2:2017 Semiconductor devices - Microwave integrated circuits. Frequency converters
- BS IEC 60748-1:2002 Semiconductor devices - Integrated circuits - General
- BS EN 60747-16-1:2002+A1:2007 Semiconductor devices — Part 16-1: Microwave integrated circuits — Amplifiers
- BS EN 60747-16-5:2013+A1:2020 Semiconductor devices - Microwave integrated circuits. Oscillators
- BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
- BS EN 62415:2010 Semiconductor devices - Constant current electromigration test
- BS IEC 62951-1:2017 Semiconductor devices. Flexible and stretchable semiconductor devices - Bending test method for conductive thin films on flexible substrates
- BS IEC 62830-7:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Linear sliding mode triboelectric energy harvesting
- BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
- BS EN 60747-5-1:2001 Discrete semiconductor devices and integrated circuits - Optoelectronic devices - General
- BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
- BS IEC 60747-5-1:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. General
- BS EN 60747-5-1:1998 Discrete semiconductor devices and integrated circuits. Optoelectronic devices. General
- BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
- BS IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation. - Part 2: Thermo power based thermoelectric energy harvesting
- BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
- BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
- BS IEC 60748-4:1997 Semiconductor devices. Integrated circuits. Interface integrated circuits
Association Francaise de Normalisation
- NF C32-018:1993 Conductors for wires and cables with small cross-sectional areas
- NF C96-015:2005 Discrete semiconductor devices - Part 15: isolated power semiconductor devices
- NF C96-015*NF EN 60747-15:2013 Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
- NF C96-050-7*NF EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection
- NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
- NF C96-017*NF EN 62374:2008 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
- NF C86-503:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Phototransistors, photodarlington transistors and phototrasistor-arrays. Blank detail specification CECC 20 003.
- NF EN IEC 60747-5-5:2020 Dispositifs à semiconducteurs - Partie 5-5 : dispositifs optoélectroniques - Photocoupleurs
- NF C80-201*NF EN 62415:2010 Semiconductor devices - Constant current electromigration test.
- NF EN 62415:2010 Dispositifs à semiconducteurs - Essai d'électromigration en courant constant
- NF EN 62047-19:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19 : compas électroniques
RU-GOST R
- GOST 29283-1992 Semiconductor devices. Discrete devices and integrated circuits. Part 5. Optoelectronic devices
- GOST 29209-1991 Semiconductor devices. Discrete devices and integrated circuits. Part 2. Rectifire diodes
- GOST 29210-1991 Semiconductor devices. Discrete devices. Part 3. Signal (including switching) and regulator diodes
- GOST 26284-1984 Semiconductor power converters. Conventional designations
- GOST 26567-1985 Semiconductor energy converters. Test methods
- GOST 18986.14-1985 Semiconductor diodes. Methods for measuring differential and slope resistances
- GOST 13350-1978 SSI conductometric liguid analysers. General specifications
GSO
- GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- GSO IEC 61788-5:2014 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- OS GSO IEC 61788-5:2014 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- BH GSO IEC 61788-5:2016 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 60747-5-4:2014 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- BH GSO IEC 60747-5-4:2016 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- OS GSO IEC 61788-12:2014 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- BH GSO IEC 61788-12:2016 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- GSO IEC 61788-12:2014 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- GSO IEC 62047-19:2021 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- BH GSO IEC 62047-19:2022 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- BH GSO IEC 60747-5-7:2022 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
- GSO IEC 60747-5-7:2021 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
Government Electronic & Information Technology Association
- GEIA-STD-0002-1-2005 Aerospace Qualified Electronic Component (AQEC) Requirements, Volume 1 ?Integrated Circuits and Semiconductors
Korean Agency for Technology and Standards (KATS)
- KS C IEC 61788-5-2021 Superconductivity-Part 5:Matrix to superconductor volume ratio measurement-Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- KS C IEC 61788-5:2016 Superconductivity-Part 5:Matrix to superconductor volume ratio measurement-Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- KS C IEC 61788-5-2016(2021) Superconductivity-Part 5:Matrix to superconductor volume ratio measurement-Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- KS C IEC 60050-521-2002(2022) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2002(2017) Semiconductor devices and integrated circuits
- KS C IEC 60050-521-2022 Semiconductor devices and integrated circuits
- KS C IEC 60747-5:2020 Semiconductor devices — Discrete devices —Part 5: Optoelectronic devices
Institute of Electrical and Electronics Engineers (IEEE)
- IEEE 444-1973 Practices and requirements for thyristor converters and motor drives; part 1: converters for dc motor armature supplies
KR-KS
- KS C IEC 61788-5-2016 Superconductivity-Part 5:Matrix to superconductor volume ratio measurement-Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- KS C IEC 60747-5-2020 Semiconductor devices — Discrete devices —Part 5: Optoelectronic devices
Danish Standards Foundation
- DS/EN 61788-5:2001 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- DS/EN 61788-5:2013 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- DS/EN 61788-12:2002 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- DS/EN 61788-12:2013 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
- DS/EN IEC 63244-1:2021 Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General requirements and specifications
International Electrotechnical Commission (IEC)
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-15:2003 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
- IEC 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
- IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
- IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
- IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
- IEC 62415:2010 Semiconductor devices - Constant current electromigration test
- IEC 61788-12:2013 Superconductivity.Part 12: Matrix to superconductor volume ratio measurement.Copper to non-copper volume ratio of Nb<(Index)3>Sn composite superconducting wires
- IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
- IEC TR 60146-6:1992 Semiconductor convertors - Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses
- IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
YU-JUS
- JUS N.C0.048-1985 Electrical power and lighting. Testing of insulated conductors and cables. Separability of cores of flat twin insulated conductors
Underwriters Laboratories (UL)
- UL 1557-2011 Electrically isolated semiconductor devices
- UL 1557-1993 Electrically isolated semiconductor devices
- UL 1557-2006 UL Standard for Safety Electrically Isolated Semiconductor Devices Fourth Edition; Reprint with Revisions through and Including 6/26/2006
- UL 1557-1997 Electrically isolated semiconductor devices
ES-UNE
- UNE-EN 61788-5:2013 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires (Endorsed by AENOR in October of 2013.)
- UNE-EN 61788-12:2013 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires (Endorsed by AENOR in November of 2013.)
- UNE-EN IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by Asociación Española de Normalización in October of 2020.)
- UNE-EN 62415:2010 Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
- UNE-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
Japanese Industrial Standards Committee (JISC)
- JIS H 7304:2002 Superconductivity -- Part 5: Matrix to superconductor volume ratio measurement -- Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors
- JIS H 7304:2017 Superconductivity -- Matrix to superconductor volume ratio measurement -- Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
- JIS C 7012:1982 Type designation system for discrete semiconductor devices
Lithuanian Standards Office
- LST EN 61788-5-2002 Superconductivity. Part 5: Matrix to superconductor volume ratio measurement. Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors (IEC 61788-5:2000)
- LST EN 61788-12-2003 Superconductivity. Part 12: Matrix to superconductor volume ratio measurement. Copper to non-copper volume ratio of Nb3Sn composite superconducting wires (IEC 61788-12:2002)
European Committee for Electrotechnical Standardization(CENELEC)
- EN 60747-15:2012 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- EN 62047-15:2015 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
- EN 61788-12:2013 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- EN 62374:2007 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
- EN IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
- EN 61788-5:2013 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires
CENELEC - European Committee for Electrotechnical Standardization
- EN 60747-15:2004 Discrete semiconductor devices Part 15: Isolated power semiconductor devices
- EN 61788-12:2002 Superconductivity Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires
- EN 62415:2010 Semiconductor devices - Constant current electromigration test
Indonesia Standards
- SNI 04-3580-1994 Requirements of copper and alumunium conductor for electric cable insulation
- SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials
DIN
- DIN EN 61788-5:2001 Superconductivity - Part 5: Matrix to superconductor volume ratio measurement; Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors (IEC 61788-5:2000); German version EN 61788-5:2001
- DIN EN 61788-12:2003 Superconductivity - Part 12: Matrix to superconductor volume ratio measurement; Copper to non-copper volume ratio of Nb<(Index)3>Sn composite superconducting wires (IEC 61788-12:2002); German version EN 61788-12:2002
ZA-SANS
- SANS 6101:2007 Adherence of dielectric to conductor of supporting cores of aerial bundled conductors
- SANS 60146-6:1992 Semiconductor convertors Part 6: Application guide for the protection of semiconductor convertors against overcurrent by fuses
German Institute for Standardization
- DIN 41772 Beiblatt 2:1979-02 Static power convertors; semiconductor rectifier equipment, examples of characteristic curves for equipment operating in parallel with batteries
- DIN EN 62374:2008 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films (IEC 62374:2007); German version EN 62374:2007
- DIN EN 62415:2010-12 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
- DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
- DIN EN 62047-19:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
Defense Logistics Agency
- DLA MIL-S-19500/230 C VALID NOTICE 4-2011 Semiconductor Device, Diode, Silicon, High-Conductance Type JAN- 1N3207
- DLA DSCC-DWG-90025 REV C-2013 SEMICONDUCTOR DEVICE, POWER SWITCHING REGULATOR ASSEMBLY
PH-BPS
- PNS IEC 62830-2:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE C37.10-1995 Guide for Diagnostics and Failure Investigation of Power Circuit Breakers
AIA/NAS - Aerospace Industries Association of America Inc.
- NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
- NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
- NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
- NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
CZ-CSN
- CSN 35 8740-1973 Semiconduotor deviees. Transistore. Measurement of saturation voltage
- CSN 35 1609-1983 Power semiconductor devices. Heat sinks. Testing methodo
- CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
American Society for Testing and Materials (ASTM)
- ASTM B354-23 Standard Terminology Relating to Uninsulated Metallic Electrical Conductors
PL-PKN
- PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits
IPC - Association Connecting Electronics Industries
- IPC TM-650 2.5.4.1-1987 Conductor Temperature Rise Due to Current Changes in Conductors
- IPC TM-650 2.5.4.1A-1997 Conductor Temperature Rise Due to Current Changes in Conductors
Aerospace Industries Association
- AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
TN-INNORPI
- NT AB 023-1970 Draden en kabels voor uitrustingen met massieve of verdeelde geleiders, met pvc geisoleerd, onder scherm, met een geleider of een tweedraads- groen.
GOSTR
- GOST 18577-1980 Thermoelectric semiconductor devices. Terms and definitions
RO-ASRO
- STAS 11381/13-1981 Graphical symbols for electrical diagrams SEMICONDUCTOR DEVICES
- STAS 12258/3-1985 Optoelectronic semiconductor devices PHOTOTRANSISTORS Terminology and essential characteristics
TR-TSE
- TS 2751-1977 Heat-Resisting (190 C) Electrical Cables With Copper Conductors For Aircraft
(U.S.) Ford Automotive Standards
- FORD ESF-M99B155-A-2002 CHEMICAL INK, CONDUCTOR (THICK FILM CONDUCTING PASTE) ***TO BE USED WITH FORD WSS-M99P1111-A***
GOST
- GOST R 71070-2023 Electronic semiconductor devices. Terms and definitions
CO-ICONTEC
- ICONTEC 2215-1986 Electronics. Conductor and terminal connector for soldering of conductors with copper
ICEA - Insulated Cable Engineers Association Inc.
- T-32-645-1993 Establishing Compatibility of Sealed Conductor Filler Compounds with Conducting Stress Control Materials
Semiconductors and Photocatalysis,Ultrapure Water and Semiconductors,Ion Chromatography and Semiconductors,Photocatalysis and Semiconductor Photocatalysis,Semiconductors and Photocurrents,Photocatalysis and Semiconductors,Semiconductor Devices and Temperature,Relays and relay systems related to power supply equipment,Optoelectronic Materials and Semiconductor Lighting,Selection and Design of Conductors and Electrical Appliances in Water Conservancy and Hydropower Projects,New semiconductor materials and devices,Electrical equipment and protective conductors,Semiconductors and UV light,Semimetals and Semiconductor Materials,Control and protection switchgear,Control circuit appliances and switching elements Electromechanical control circuit appliances,Control and protection switchgear (equipment) Control and protection switchgear (equipment),Control circuit appliances and switching elements,Conductors and Electrical Appliances,Conductor and electrical equipment selection design technical regulations