Semiconductor particle number reversal conditions
Semiconductor particle number reversal conditions, Total:234 items.
The international standard classification for "Semiconductor particle number reversal conditions" includes: Aircraft and space vehicles in general , Nuclear energy engineering , Radiation measurements , Mechanical structures for electronic equipment , Integrated circuits. Microelectronics , Electrical equipment of ships and of marine structures , Optoelectronics. Laser equipment , Electronic components in general , Motors , Space systems and operations , Packaging machinery , Aerospace electric equipment and systems , Semiconductor devices in general .
The Chinese standard classification for "Semiconductor particle number reversal conditions" includes: Ambient conditions , Nuclear detector , Nuclear instrument and detector in general , Semiconductor integrated circuit , Power generation, transformation and distribution equipment for vessel , Laser device , Basic standards and general methods , Electric drive control equipment , Semiconductor discrete devices in general , Electronic components , Steam turbine and its auxiliary equipment , Storage equipment and handling machinery , Optoelectronic device assembly , Technical management , Technical Management , Technical management , Technical management , Technical management .
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China
- GB/T 12667-1990 General specification for excitation assembly with semiconductor for synchronous motor
- GB/T 30640-2014 General specification of automatic counting and packaging line
- GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
- GB/T 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB 15651.4-2017 Semiconductor devices Discrete devices Part 5-4: Optoelectronic devices Semiconductor lasers
- GB/T 12565-1990 Semiconductor devices Sectional specification for optoelectronic devices
- GB/T 5201-2012 Test procedures for semiconductor charged particle detectors
- GB/T 13973-1992 specification for semiconductor device curve tracers
- GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses
- GB/T 43226-2023 Time-domain test methods for space single event soft errors of semiconductor integrated circuit
- GB/T 29299-2012 General specification of semiconductor laser rangefinder
- GB/T 14548-1993 specification for marine semiconductor conver - Tors
- GB/T 12669-1990 General specification for cascade speed control assembly with semiconductor converter
- GB 5839-1986 Rating systems for electronic tubes and semiconductor devise
- GB/T 36042-2018 Specification of rotor forgings for ultra-supercritical steam turbine
- GB/T 44181-2024 Space environment—Method of single event upset rates prediction of semiconductor devices for space applications
- GB/T 42839-2023 Semiconductor integrated circuits—Analog digital (AD) converter
- GB/T 12669-2012 General specification for cascade speed control assembly with semiconductor converter
- GB 7423.1-1987 sink of semiconductor devices - Generic specification
- GB/T 42973-2023 Semiconductor integrated circuits—Digital-analog(DA)converter
- GB/T 12667-2012 General specification for excitation assembly with semiconductors for synchronous motors
- GB/T 5201-1994 Test procedures for semiconductor charged particle detectors
- GB 12565-1990 Sectional Specification for Semiconductor Devices and Optoelectronic Devices
Professional Standard - Aerospace
- QJ 2502-1993 General specification for radiation hardened semiconductor discrete devices
- QJ 3044-1998 Semiconductor Integrated Circuit - Test Method for Digital-to-analog Conventer and Digital-to-analog Converter
- QJ 787-1983 Semiconductor Discrete Devices - Specifications for Screening
- QJ 10005-2008 Test guidelines of single event effects induced by heavy ions of semiconductor devices for space applications
- QJ 786-1983 Semiconductor Integrated Circuits - Specifications for Screening
Group Standards of the People's Republic of China
- T/CIE 119-2021 Test method and procedure of atmospheric-neutron induced single event effects in semiconductor devices
Military Standard of the People's Republic of China-General Armament Department
- GJB/Z 41.3-1993 Military semiconductor discrete device series spectrum semiconductor optoelectronic devices
- GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
- GJB 33/17-2011 Semiconductor optoelectronic device.Detail specification for type GO11 semiconductor photocoupler
- GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor
- GJB 33/18-2011 Semiconductor optoelectronic device.Detail specification for type GO417 bidirectional analog switch semiconductor photocoupler
- GJB 8119-2013 General specification for semiconductor optoelectronic device
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会
- GB/T 15651.4-2017 Semiconductor devices-Discrete devices-Part 5-4:Optoelectronic devices-Semiconductor lasers
Professional Standard - Machinery
- JB/T 5781-1991 Sectioned Radiator for Power Semiconductor Devices. Technical Specification
- JB/T 7027-1993 300-600 MW Steam Turbine Rotor Body Forging Specifications
- JB/T 7027-2014 Rotor Forgings for 300 MW Steam Turbines and Above - Technical Specification
- JB/T 5537-1991 Semiconductor pressure sensor technical conditions
- JB/T 5844-1991 Directional relays and power relays with two input energizing quantities (IEC 60255-12: 1980 NEQ)
- JB/T 7022-2014 The Rotor Forgings for Industrial Steam Turbines - Technical Specification
- JB/T 7064-1993 General Specifications for Semiconductor Inverters
- JB/T 7022-2002 Specification for rotor forgings for industrial steam turbines
- JB/T 7022-1993 Specifications for industrial steam turbine rotor body forgings
Professional Standard - Electron
- SJ/T 10825-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2013 HTL Hex inverters
- SJ/T 10821-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CH2007 HTL Quad inverters
- SJ 2757-1987 Method of measurement by infra-red reflection for charge carrier concentraiton of heavily doped semiconductors
- SJ/T 10810-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CT1004 TTL Hex inverters (Applicable for certification)
- SJ 1794-1981 General specification for diffusion furnace for semiconductor device manufacturing
- SJ 20179-1992 Semiconductor discrete device-Detail specification for reverse-blocking thyristor for Type 3CT103
- SJ 20181-1992 Semiconductor discrete device-Detail specification for reverse-blocking thyristor for Type 3CT107
- SJ 20180-1992 Semiconductor discrete device-Detail specification for reverse-blocking thyristor for Type 3CT105
- SJ/T 10883-1996 Detailed specifications for electronic components - Semiconductor integrated circuits - CDA7520 10-bit D/A converters (Applicable for certification)
- SJ/T 10149-1991 Graphic base of electronic components graphics of semiconductor discrete device
- SJ 2355.3-1983 Method of measurement for reverse current of light-emitting devices
- SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes
- SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices
未注明发布机构
- DIN EN 60749-44 E:2014-08 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- IEEE Std 300-1988(R2006) IEEE Standard Test Procedures for Semiconductor Charged-Particle Detectors
Professional Standard - Railway
- TB/T 2437-1993 Specifications for locomotive semi-conductor converters
Professional Standard - Agriculture
- GB/T 43967-2024 Space environment—Test method of single event effects induced by pulsed laser of semiconductor devices for space application
机械电子工业部
- JB 5781-1991 Technical conditions of profile radiators for power semiconductor devices
Professional Standard - Military and Civilian Products
- WJ 1807-2000 Technical screening conditions of semiconductor diodes and triodes for use of ordnance
Professional Standard - Aviation
- HB 5832-1983 Technical Specifications of Semiconductor Diode and Triode Screening for Aviation
Professional Standard - Traffic
- JT/T 1512-2024 Technical requirements for semiconductor low-voltage power distribution equipment for passenger cars
Association Francaise de Normalisation
- NF EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: test method for the effects of a single event (SEE) irradiated by a neutron beam for semiconductor devices
- NF C86-010:1986 Semiconductor devices. Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Generic specification.
- NF EN IEC 62435-3:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 3: data
- NF C96-435-3*NF EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data
- NF C96-779-3*NF EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
- NF C80-203*NF EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs).
- NF C93-884-8*NF EN 62149-8:2014 Fibre optic active components and devices - Performance standard - Part 8 : seeded reflective semiconductor optical amplifier devices
- NF EN 62417:2010 Semiconductor Devices – Mobile Ion Testing for Metal Oxide Field Effect Semiconductor Transistors (MOSFETs)
- NF EN 62416:2010 Semiconductor Devices – Hot Carrier Testing on MOS Transistors
- NF C80-202*NF EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- NF C93-884-9*NF EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9 : seeded reflective semiconductor optical amplifier transceivers
- NF EN 62779-3:2016 Dispositifs à semiconducteurs - Interface à semiconducteurs pour les communications via le corps humain - Partie 3 : type fonctionnel et ses conditions d'utilisation
- NF EN 62047-19:2014 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 19 : compas électroniques
- NF C96-435-4*NF EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4 : storage
- NF EN 62435-1:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 1: general
SCC
- IEC 60146:1973/AMD1:1975 Amendment 1 - Semiconductor convertors
- DANSK DS/EN 60749-44:2016 Semiconductor devices – Mechanical and climatic test methods – Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- CEI EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- IEC 60333:1983 Test procedures for semiconductor charged-particle detectors
- CEI 22-2:1998 Semiconductor power electronic converters for industrial and traction applications
- DANSK DS/EN IEC 62435-3:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data
- CEI EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices Part 3: Data
- CEI EN 62779-3:2017 Semiconductor devices - Semiconductor interface for human body communication Part 3: Functional type and its operational conditions
- DIN EN 60749-44 E:2014 Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)
- BS 3839:1965 Oxygen free high conductivity copper for electronic tubes and semiconductor devices
- DANSK DS/EN 62779-3:2016 Semiconductor devices – Semiconductor interface for human body communication – Part 3: Functional type and its operational conditions
- CEI EN 62149-8:2015 Fibre optic active components and devices - Performance standard Part 8: Seeded reflective semiconductor optical amplifier devices
- DANSK DS/EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
- DIN EN IEC 62435-3:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (IEC 62435-3:2020); German version EN IEC 62435-3:2020
- CEI EN 62417:2011 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DANSK DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- CEI EN 62416:2011 Semiconductor devices - Hot carrier test on MOS transistors
- DANSK DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
- DANSK DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- DIN IEC 60333:1995 Nuclear instrumentation - Semiconductor charged-particle detectors - Test procedures (IEC 60333:1993)
- DANSK DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- CEI EN 62047-19:2014 Semiconductor devices - Micro-electromechanical devices Part 19: Electronic compasses
- BS 9970-0:1985 Harmonized system of quality assessment for electronic components. Semiconductor devices-Generic specification
- DIN EN 62779-3 E:2014 Draft Document - Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 47/2197/CD:2014)
- CEI EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices Part 4: Storage
GSO
- GSO IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- GSO IEC 60333:2009 Nuclear instrumentation - Semiconductor charged-particle detectors - Test procedures
- GSO IEC 62779-3:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- OS GSO IEC 60333:2009 Nuclear instrumentation - Semiconductor charged-particle detectors - Test procedures
- GSO IEC 62149-8:2017 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
- OS GSO IEC 62149-8:2017 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
- BH GSO IEC 62047-19:2022 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- GSO IEC 62047-19:2021 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
- BH GSO IEC 62435-4:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
German Institute for Standardization
- DIN EN 60749-44:2017-04 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
- DIN 50452-2:2009 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 2: Determination of particles by optical particle counters
- DIN 50452-3:1995-10 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
- DIN 41762-2:1974-02 Static power convertors; rating code designation for semiconductor convertor stacks and assemblies, monocrystalline semiconductor convertor stacks and assemblies
- DIN 50452-3:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 3: Calibration of optical particle counters
- DIN 50452-2:1991 Testing of materials for semiconductor technology; test method for particle analysis in liquids; determination of particles with optical particle counters
- DIN EN 62417:2010-12 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
- DIN EN 62416:2010-12 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010); German version EN 62416:2010
- DIN EN 60749-16:2003-09 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
- DIN 50452-1:1995 Testing of materials for semiconductor technology - Test method for particle analysis in liquids - Part 1: Microscopic determination of particles
- DIN EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
- DIN EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
- DIN EN 62047-19:2014-04 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
British Standards Institution (BSI)
- BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
- BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
- BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
- BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- BS EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 5: Die and wafer devices
- BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
- BS IEC 60747-18-1:2019 Semiconductor devices. Semiconductor bio sensors. Test method and data analysis for calibration of lens-free CMOS photonic array sensors
- BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
- BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
- BS EN 62047-5:2011 Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
- BS EN 62047-19:2013 Semiconductor devices. Micro-electromechanical devices. Electronic compasses
- BS 3839:1978 Specification for oxygen-free high-conductivity copper for electronic tubes and semiconductor devices
- BS QC 790304:1994 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear analogue-to-digital converters (ADC)
- BS EN IEC 62969-4:2018 Semiconductor devices. Semiconductor interface for automotive vehicles. Evaluation method of data interface for automotive vehicle sensors
- BS QC 790303:1994 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Linear digital-to-analogue converters (DAC)
- BS IEC 60748-4-3:2006 Semiconductor devices. Integrated circuits - Interface integrated circuits. Dynamic criteria for analogue-digital converters (ADC)
- BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
- BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
- 18/30367158 DC BS EN 62435-3. Electronic components. Long-term storage of electronic semiconductor devices. Part 3. Data
- BS QC 720100:1991 Harmonized system of quality assessment for electronic components. Semiconductor devices. Sectional specification for optoelectronic devices
- BS IEC 60748-2:1998 Semiconductor devices. Integrated circuits. Digital integrated circuits
- BS IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Digital integrated circuits
ES-UNE
- UNE-EN 300386 V1.5.1:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
- UNE-EN 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
- UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
- UNE-EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
- UNE-EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices (Endorsed by AENOR in August of 2014.)
- UNE-EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)
- UNE-EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors (Endorsed by AENOR in September of 2010.)
- UNE-EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
- UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)
PH-BPS
- PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
- PNS IEC 62435-3:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
International Electrotechnical Commission (IEC)
- IEC 60747-16-3:2010 Semiconductor devices – Part 16-3: Microwave integrated circuits – Frequency converters
- IEC 60747-5-4:2022 Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
- IEC 60333:1993 Nuclear instrumentation; semiconductor charged-particle detectors; test procedures
- IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
- IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
- IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- IEC 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
- IEC 60747-7-5:2005 Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors for power switching applications
- IEC 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
American National Standards Institute (ANSI)
- ANSI/IEEE 300:1988 Test Procedures for Semiconductor Charged-Particle Detectors
CZ-CSN
- CSN 35 8734-1975 Semieonductor devices. Diodcs. Measurement of reverse current.
- CSN 35 8773-1977 Meaaurement of semiconductor devices. Thyristors. Meaaurement of blocking current and reverse blocking current.
- CSN 35 8851-1987 Semiconductor optoelectronic devices. Nomenclature, definition and letter symbols of parameters
- CSN 34 5912-1987 Wire of aluminium-silicon alloy for bonding of electronic semiconductor devices
RU-GOST R
- GOST 20859.1-1989 Power semiconductor devices. General technical requirements
- GOST 30617-1998 Power semiconductor modules. General specifications
- GOST 24376-1991 Semiconductor inverters. General specifications
- GOST 24607-1988 Semiconductor frequency converters. General technical requirements
- GOST 20215-1984 Semiconductor microwave diodes. General specifications
- GOST 28624-1990 Semiconductor devices. Part 11. Sectional specification for discrete devices
- GOST 24354-1980 Semiconductor character displays. Basic dimensions
- GOST 27299-1987 Semiconductor optoelectronic devices. Terms, definitions and letter symbols of parameters
GOST
- GOST R 71057-2023 Integrated semiconductor circuits. Analog-to-digital and digital-to-analog converters. Parameters system
- GOST R 71070-2023 Electronic semiconductor devices. Terms and definitions
- GOST 20859.1-1979 Semiconductor power devices of a single unified series. General technical conditions
- GOST R 71014-2023 Semiconductor and optoelectronic devices. Octrons. Parameters system
IEEE - The Institute of Electrical and Electronics Engineers@ Inc.
- IEEE 300-1988 Standard Test Procedures for Semiconductor Charged-Particle Detectors
- IEEE 300-1982 STANDARD TEST PROCEDURES FOR SEMICONDUCTOR CHARGED-PARTICLE DETECTORS
European Committee for Electrotechnical Standardization(CENELEC)
- EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
- EN 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
- EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
- EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
- EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
American Society for Testing and Materials (ASTM)
- ASTM F1192-24 Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
- ASTM F1192-11 Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
Institute of Electrical and Electronics Engineers (IEEE)
- IEEE Std 300-1988 IEEE Standard Test Procedures for Semiconductor Charged-Particle Detectors
- ANSI/IEEE Std 300-1982 IEEE Standard Test Procedures for Semiconductor Charged-Particle Detectors
Defense Logistics Agency
- DLA SMD-5962-77027 REV C-1982 MICROCIRCUITS, DIGITAL, CMOS, HEX INVERTER, MONOLITHIC SILICON
- DLA SMD-5962-87809 REV B-2006 MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, OCTAL INVERTING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON
- DLA SMD-5962-79014 REV B-1987 MICROCIRCUIT, DIGITAL, CMOS, HEX INVERTER BUFFER, MONOLITHIC SILICON
Danish Standards Foundation
- DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
- DS/EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
- DS/EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND)
- DS/IEC 747-5:1986 Semiconductor devices. Discrete devices and integrated circuits. Part 5: Optoelectronic sevices
VDE - VDE Verlag GmbH@ Berlin@ Germany
- VDE 0884-79-3-2017 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016); German version EN 62779-3:2016
- VDE 0884-79-3-2014 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 47/2197/CD:2014)
- VDE 0886-149-8-2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices (IEC 62149-8:2014); German version EN 62149-8:2014
PL-PKN
- PN-EN IEC 62435-3-2020-11 E Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (IEC 62435-3:2020)
- PN E01200-05-1992 Graphical symbols for diagrams Semiconductor devices and electron tubes
AIA/NAS - Aerospace Industries Association of America Inc.
- NAS4121-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Formed
- NAS4122-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Extruded
- NAS4119-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Press-On Type
- NAS4119-2011 HEAT SINK@ ELECTRONIC COMPONENT@ SEMICONDUCTOR DEVICES@ PRESS-ON TYPE (Rev 1)
- NAS4124-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Dual Link
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- JEDEC JESD57-1996 Test Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation
Korean Agency for Technology and Standards (KATS)
- KS C IEC 60749-16:2006 Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C IEC 60749-16-2006(2016) Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS C IEC 60749-16-2021 Semiconductor devices-Mechanical and climatic test methods-Part 16:Particle impact noise detection(PIND)
- KS V 8209-1999(2004) Electrical installations in ships Part 304:Equipment-Semiconductor convertors
- KS C 6520-2008 Components and materials of semiconductor process-Measurement of wear characteristics by plasma
Aerospace Industries Association/ANSI Aerospace Standards
- AIA/NAS NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
- AIA/NAS NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
- AIA/NAS NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
AENOR
- UNE-EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Aerospace Industries Association
- AIA NAS 4122-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Extruded
- AIA NAS 4124-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Dual Link
- AIA NAS 4119-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Press-On Type
- AIA NAS 4121-1996 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, Formed FSC 5999
FI-SFS
- SFS 5327-1987 Glossary of electronic technology. Semiconductor components and overall circuits
Lithuanian Standards Office
- LST EN 62416-2010 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010)