Sign In |Help & Support
ALL SECTORS
  • ALL SECTORS
  • GB(National Standard)
  • CB(Shipping)
  • CECS(Engineering Construction)
  • CJ(Urban Construction)
  • CY(News and Publication)
  • DB(Provincial Standard)
  • DL(Electricity & Power)
  • DZ(Geology & Mineralogy)
  • FZ(Spinning & Textile)
  • GA(Public Security)
  • HB(Aviation)
  • HG(Chemical Industry)
  • HJ(Environmental Protection)
  • JB(Machinery)
  • JC(Building Materials)
  • JG(Building & Construction)
  • JJ(Metering)
  • JT(Highway & Transportation)
  • LY(Forestry)
  • MT(Coal)
  • NB(Energy)
  • NY(Agriculture)
  • QB(Light Industry)
  • QC(Automobile & Vehicle)
  • QJ(Aerospace)
  • SH(Petrochemical)
  • SJ(Electronics)
  • SL(Water Resources)
  • SN(Commodity Inspection)
  • SY(Oil & Gas)
  • TB(Railway & Train)
  • YB(Ferrous Metallurgy)
  • YC(Tobacco)
  • YD(Telecommunication)
  • YY(Medical Device)
Database: 365,228(8 Aug 2026)

Ion sputtering instrument gold spraying rate

Ion sputtering instrument gold spraying rate, Total:38 items.

The international standard classification for "Ion sputtering instrument gold spraying rate" includes: Vacuum technology , Chemical analysis , Aluminium and aluminium alloys , Other products of non-ferrous metals .

The Chinese standard classification for "Ion sputtering instrument gold spraying rate" includes: Vacuum technique and equipment , Basic standards and general methods , Light metals and their alloys , Rare refractory metals and their compounds .


Professional Standard - Machinery

Professional Standard - Electron

  • SJ 1781-1981 Sputtering ion pump--Testing methods
  • SJ 1780-1981 Ordinary two-electrode sputtering ion pump--Performance specification
  • SJ 1779-1981 Ordinary two-electrode sputtering ion pump--Parameters series

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

  • GB/T 32999-2016 Surface chemical analysis―Depth profiling―Measurement of sputtering rate:mesh-replica method using a mechanical stylus profilometer

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 25755-2010 Vacuum technology - Sputter-ion pumps - Measurement of performance characteristics
  • GB/T 29658-2013 High-purity sputtering aluminium and aluminium alloy target used in electronic film

Group Standards of the People's Republic of China

Professional Standard - Non-ferrous Metal

  • YS/T 1025-2015 High-purity tungsten and tungsten alloy sputtering target used in electronic film

国家市场监督管理总局、中国国家标准化管理委员会

  • GB/T 41064-2021 Surface chemical analysis—Depth profiling—Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films

German Institute for Standardization

  • DIN 28429:2003 Vacuum technology - Acceptance specifications for getter ion pumps

British Standards Institution (BSI)

  • BS ISO 17109:2022 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter dept profiling using single and multi-layer thin…
  • 21/30433862 DC BS ISO 17109 AMD1. Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and…
  • BS ISO 17109:2015 Surface chemical analysis. Depth profiling. Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
  • PD ISO/TR 22335:2007 Surface chemical analysis. Depth profiling. Measurement of sputtering rate. Mesh-replica method using a mechanical stylus profilometer

SCC

  • ISO 17109:2015/DAmd 1 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films — A...
  • BS PD ISO/TR 22335:2007 Surface chemical analysis. Depth profiling. Measurement of sputtering rate. Mesh-replica method using a mechanical stylus profilometer
  • 04/30098988 DC ISO 22335. Surface chemical analysis. Depth profiling. Measurement of sputtering rate. Meshreplica method with the use of a mechanical stylus profilometer

Society of Automotive Engineers (SAE)

Korean Agency for Technology and Standards (KATS)

RU-GOST R

  • GOST 5.1807-1973 Type-GIN-0,5-1M getter-ion pump. Quality requirements of certified products
  • GOST 22091.2-1984 X-ray devices. The methods of measuring of the current and the voltage of injection of X-ray betatrons

International Organization for Standardization (ISO)

  • ISO 17109:2022 Surface chemical analysis — Depth profiling — Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth p
  • ISO 17109:2015 Surface chemical analysis - Depth profiling - Method for sputter rate determination in X-ray photoelectron spectroscopy, Auger electron spectroscopy and secondary-ion mass spectrometry sputter depth profiling using single and multi-layer thin films
  • ISO/TR 22335:2007 Surface chemical analysis - Depth profiling - Measurement of sputtering rate: mesh-replica method using a mechanical stylus profilometer

GSO

  • OS GSO ISO/TR 22335:2009 Surface chemical analysis - Depth profiling – Measurement of sputtering rate – mesh-replica method using a mechanical stylus profilometer

American Society for Testing and Materials (ASTM)

  • ASTM E1162-87(2001) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)
  • ASTM E1162-87(1996) Standard Practice for Reporting Sputter Depth Profile Data in Secondary Ion Mass Spectrometry (SIMS)

U.S. Air Force

United States Navy