GB/T 6620-1995 in English

SUPERSEDED

Test method for measuring warp on silicon slices by noncontact scanning

Issued on:1995-04-18
Implemented on:1995-01-02
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $90.00
$88.00

Standard No:	GB/T 6620-1995
Document status:	SUPERSEDED
Superseded by:	GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
Superseded on:	2010-06-01
Title in English:	Test method for measuring warp on silicon slices by noncontact scanning
Title in Chinese:	硅片翘曲度非接触式测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	1995-04-18
Implemented on:	1995-01-02
Chinese Classification:	H21-Metal physical property test method
Professional Classification:	GB-National Standard
Related Keywords:	silicon wafers circular silicon wafers silicon slices test method non-contact measurement method
Related Topics:	song afm contact silicon wafer song+ contact plate method silicon way Contact Angle Test Method Contact sheet cleaning Contact Angle Test Method contact test method contact spotting afm contact and A few curls contact test pressure Warpage warping test Measure warpage The purpose of the contact sheet How to measure warpage silicon contact disc warping disc warping non contact Contactless afm contact tap and touch Non-contact resistance measurement Test contact angle method contact afm sheet curve silicon wafer for testing Silicon test piece contact plate method afm semi-contact Contact Angle Test Method GBT6620 GBT6620-1995 GB/T 6620-2009 Tablet Hardness Test Method Non-contact metal thickness detection method Non-contact mobility tester Contactor detection method Glass warpage test method Warpage standard sheet Water contact angle test method Machining warpage Chip contact resistance test method Semiconductor silicon wafer warpage Contact angle tester test method Warpage test table Substrate warpage measurement Optical material warpage test Silicon wafer warpage industry Contact disc detection method Warpage test method Non-contact measurement accuracy Plastic warpage measurement method Plastic warpage test method Liquid contact angle test method Silicon wafer contact angle measurement Ceramic substrate warpage measurement Silicone oil alkalinity test method Sample preparation method for water contact angle test What is the standard for ceramic warpage testing method? fragment join method Tramadol conversion method equation Warpage measurement abroad Analysis of the shortcomings of non-contact temperature measurement methods Wafer warpage detection

《GB/T 6620-1995硅片翘曲度非接触式测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了硅单晶切割片、研磨片、抛光片翘曲度的非接触式测量方法。本标准适用于测量直径大于50mm，厚度为150～1000μm的圆形硅片的翘曲度。本标准也适用于测量其他半导体圆片的翘曲度。

Scope

This standard specifies the non-contact measurement method for the warpage of silicon single crystal cutting wafers, grinding wafers and polishing wafers (hereinafter referred to as silicon wafers). This standard is suitable for measuring the warpage of circular silicon wafers with a diameter greater than 50mm and a thickness of 150-1000μm. This standard is also suitable for measuring the warpage of other semiconductor wafers.

More samples: JGJ 94-2008 GB 18306-2015 YD/T 3934-2021

Sample only — not a preview of GB/T 6620-1995

Loading PDF document...

Error loading PDF. Please make sure the file is valid and try again.

We also recommend

GB/T 21227-2021 in English

AC loss measurements—Magnetometer methods for hysteresis loss in superconducting multifilamentary composites
2021-05-21
GB/T 3655-2022 in English

Methods of measurement of the magnetic properties of electrical steel strip and sheet by means of an epstein frame
2022-10-12
GB/T 25897-2020 in English

Residual resistance ratio measurement—Residual resistance ratio of Nb-Ti and Nb3Sn composite superconductors
2020-12-14

GB/T 6620-1995 in English

Test method for measuring warp on silicon slices by noncontact scanning

We also recommend

GB/T 21227-2021 in English

GB/T 3655-2022 in English

GB/T 25897-2020 in English