GB/T 6620-2009 in English

VALID

Test method for measuring warp on silicon slices by noncontact scanning

Issued on:2009-10-30
Implemented on:2010-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 6620-2009
Document status:	VALID
Title in English:	Test method for measuring warp on silicon slices by noncontact scanning
Title in Chinese:	硅片翘曲度非接触式测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2009-10-30
Implemented on:	2010-06-01
Superseding:	GB/T 6620-1995 Test method for measuring warp on silicon slices by noncontact scanning
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H82-Elemental semiconductor material
Professional Classification:	GB-National Standard
Related Keywords:	test method non-contact test method silicon slices circular silicon wafers test
Related Topics:	afm contact silicon wafer contact plate method silicon way Contact sheet cleaning contact test method contact spotting afm contact and contact test pressure Warpage warping Measure warpage The purpose of the contact sheet How to measure warpage silicon contact disc warping disc warping non contact Contactless afm contact tap and touch Non-contact resistance measurement test wafer test wafer contact afm sheet curve silicon wafer for testing Silicon test piece contact plate method afm semi-contact GBT6620 GBT6620-1995 GB/T 6620-2009 Tablet Hardness Test Method Non-contact metal thickness detection method Non-contact mobility tester Glass warpage test method Warpage standard sheet Machining warpage Chip contact resistance test method Semiconductor silicon wafer warpage Contact angle tester test method Warpage test method Warpage test table Substrate warpage measurement Optical material warpage test Silicon wafer warpage industry Contact disc detection method Warpage test method Non-contact measurement accuracy Plastic warpage measurement method Plastic warpage test method Silicon wafer contact angle measurement Ceramic substrate warpage measurement Silicone oil alkalinity test method What is the standard for ceramic warpage testing method? Silicon wafer standard thickness fragment join method Tramadol conversion method equation Warpage measurement abroad Analysis of the shortcomings of non-contact temperature measurement methods Wafer warpage detection

《GB/T 6620-2009硅片翘曲度非接触式测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了硅单晶切割片、研磨片、抛光片(以下简称硅片)翘曲度的非接触式测试方法。
本标准适用于测量直径大于50mm,厚度大于180μm 的圆形硅片。本标准也适用于测量其他半导体圆片的翘曲度。本测试方法的目的是用于来料验收或过程控制。本测试方法也适用于监视器件加工过程中硅片翘曲度的热化学效应。

Scope

This standard specifies the non-contact test method for the warpage of silicon single crystal cutting discs, grinding discs and polishing discs. This standard applies to the measurement of circular silicon wafers with a diameter greater than 50 mm and a thickness greater than 180 μm. This standard is also suitable for measuring the warpage of other semiconductor wafers. The purpose of this test method is for incoming material acceptance or process control. This test method is also suitable for monitoring the thermochemical effects of wafer warpage during device processing.

More samples: JGJ 94-2008 JC/T 2453-2018 DL/T 368-2010

Sample only — not a preview of GB/T 6620-2009

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