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Database: 365,228(8 Aug 2026)

phase field crystal

phase field crystal, Total:162 items.

The international standard classification for "phase field crystal" includes: Transistors , Other semiconductor devices , Semiconductor devices , Solar energy engineering , Ophthalmic equipment , Advanced ceramics , Materials for aerospace construction .

The Chinese standard classification for "phase field crystal" includes: Semiconductor triode , Field effect device , Physical power source , Semiconductor diode , Extracorporeal circulation, artificial organ and prosthesis device , Medical optical instrument and endoscope , Laser device , Basic standards for aviation and aerospace materials , Technical management , Technical management .


Group Standards of the People's Republic of China

  • T/CASAS 022-2022 Technical specification for gallium nitride field effect transistor used in line terminal units and triphase electricity meters
  • T/CASAS 006-2020 The general specification for silicon carbide metal-oxide-semiconductor field-effect-transistor

Professional Standard - Non-ferrous Metal

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

  • GB/T 4586-1994 Semiconductor devices-Discrete devices-Part 8: Field-effect transistors
  • GB/T 21039.1-2007 Semiconductor devices—Discrete devices—Part 4-1:microwave diodes and transistors—Microwave field effect transistors—Blank detail specification
  • GB/T 18210-2000 Crystalline silicon photovoltaic (PV) array - On-site measurements of I-V characteristics
  • GB/T 15449-1995 Blank detail-specification for field-effect transistors for case-rated swatching application
  • GB/T 6219-1998 Semiconductor devices- Discrete devices- Part 8:Field-effect transistors -Section One-Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz
  • GB/T 15450-1995 Blank detail specification for silicon dual-qute field-effect transistors

Professional Standard - Medicine

Military Standard of the People's Republic of China-General Armament Department

  • GJB/Z 41.4-1993 Military semiconductor discrete device series spectrum field effect transistor

Professional Standard - Building Materials

  • JC/T 2146-2012 Heavily MgO-doped lithium niobate crystal for quasi-phase-matching application

Professional Standard - Aviation

  • HB 6742-1993 Determination of Crystal Orientation for Monocrystal Blade - X-ray Back-reflection Laue Photograph Method

Hebei Provincial Standard of the People's Republic of China

  • DB13/T 5222-2020 Determination of Purity of Nematic Thermotropic Liquid Crystal Monomer by Gas Chromatography

Professional Standard - Machinery

  • JB/T 6307.5-1994 Power Semiconductor Module Test Methods Bipolar Transistors Single-Phase Bridge and Three-Phase Bridge

Professional Standard - Aerospace

  • QJ 2617-1994 Acceptance Specification for Tube of Microwave Field Effect Transistor (Microwave FET)

Professional Standard - Electron

  • SJ 2748-1987 Blank detail specification for single-gate low noise microwave FETs
  • SJ 20184-1992 Semiconductor discrete device-Detail specification for field-effect transistor of Types CS3821,3822,3823
  • SJ 20231-1993 Verification regulation of KDK double gate FET Yfs tester
  • SJ/Z 9154.2-1987 Measurement of quartz crystal unit parameters by zero phase technique in a π-network - Part 2: Phase offset method for measurement of motional capacitance of quartz crystal units
  • SJ 50033/78-1995 Semiconductor discrete devices - Detail specification for Type CS0464 GaAs microwave FET
  • SJ 20789-2000 Rapid screening test methods for Thermal sensitive parameter of MOS field effect transistor

Taiwan Provincial Standard of the People's Republic of China

  • CNS 8106-1981 Method for Measuring MOSFET Saturated Threshold Voltage
  • CNS 8104-1981 Method for Measuring MOSFET Linear Threshold Voltage

National Metrological Verification Regulations of the People's Republic of China

未注明发布机构

  • SA/SNZ TR IEC 63167:2021 Assessment of contact current related to human exposure to electric, magnetic and electromagnetic fields

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

  • JEDEC JES2-1992 Transistor, Gallium Arsenide Power Fet, Generic Specification

GOST

SCC

  • BS IEC 60747-4-1:2000 Semiconductor devices. Discrete devices-Microwave diodes and transistors. Microwave field effect transistors. Blank detail specification-BDS for microwave field-effect transistors
  • MIL MIL-PRF-19500/748B-2017 TRANSISTOR, FIELD EFFECT TRANSISTOR, P-CHANNEL, SILICON, TYPE 2N7505, JANTX, JANTXV AND JANS (SUPERSEDING MIL-PRF-19500/748A)
  • BS 6493-1.8:1985 Semiconductor devices. Discrete devices-Recommendations for field-effect transistors
  • MIL MIL-PRF-19500/385J-2015 Transistors, Junction Field Effect, N-Channel, Silicon, Device Types 2N4856 Through 2N4861, JAN, JANTX, JANTXV, and JANS
  • MIL MIL-PRF-19500/385H-2009 Transistors, Junction Field Effect, N-Channel, Silicon, Device Types 2N4856 Through 2N4861, JAN, JANTX, JANTXV, and JANS
  • MIL MIL-PRF-19500/385K-2019 Transistors, Junction Field Effect, N-Channel, Silicon, Device Types 2N4856 Through 2N4861, JAN, JANTX, JANTXV, and JANS
  • AS 2547.1.8:1986 Semiconductor devices, Part 1.8: Discrete devices - Field-effect transistors
  • MIL MIL-PRF-19500/295F-2012 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2608, JAN and UB
  • MIL MIL-PRF-19500/295E-2004 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2608, JAN and UB
  • MIL MIL-PRF-19500/295G-2020 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2608, JAN and UB
  • BS IEC 60747-8:2000 Discrete semiconductor devices and integrated circuits-Field-effect transistors-Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors.
  • MIL MIL-PRF-19500/295C-2001 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2608, JAN and UB
  • MIL MIL-PRF-19500/296E-2004 SEMICONDUCTOR DEVICE, FIELD-EFFECT TRANSISTORS, P-CHANNEL, SILICON, TYPE 2N2609, JAN AND UB
  • MIL MIL-PRF-19500/295D-2003 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2608, JAN and UB
  • MIL MIL-PRF-19500/296D-2003 SEMICONDUCTOR DEVICE, FIELD-EFFECT TRANSISTORS, P-CHANNEL, SILICON TYPES 2N2609, JAN, AND U
  • MIL MIL-PRF-19500/296C-2001 SEMICONDUCTOR DEVICE, FIELD-EFFECT TRANSISTORS, P-CHANNEL, SILICONTYPES 2N2609, JAN, AND UB
  • MIL MIL-PRF-19500/296G-2020 SEMICONDUCTOR DEVICE, FIELD-EFFECT TRANSISTORS, P-CHANNEL, SILICONTYPES 2N2609, JAN, AND UB
  • MIL MIL-PRF-19500/296F-2012 Semiconductor Device, Field-Effect Transistors, P-Channel, Silicon, Type 2N2609, JAN and UB
  • MIL MIL-PRF-19500/751A-2014 Semiconductor Device, Field Effect Transistor, P-Channel, Silicon, Type 2N7508U3, JANTX, JANTXV, and JANS
  • IEC 60747-8:1984/AMD1:1991 Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • BS EN ISO 11979-10:2006+A1:2014 Ophthalmic implants. Intraocular lenses-Phakic intraocular lenses
  • MIL MIL-PRF-19500/692B-2015 Transistor, Field Effect, N-Channel, Silicon, Types 2N7515, 2N7516, and 2N7517, JANTXV and JANS
  • 07/30161967 DC BS EN 60747-8. Semiconductor devices. Discrete devices. Part 8. Field-effect transistors
  • IEC 60747-8:1984/AMD2:1993 Amendment 2 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • MIL MIL-PRF-19500/696-2001 SEMICONDUCTOR DEVICE, FIELD EFFECT TRANISISTOR, PLASTIC, N-CHANNEL, SILICON TYPE 2N7537, 2N7537A, JAN, JANTX
  • MIL MIL-S-19500/296B-1993 SEMICONDUCTOR DEVICE, FIELD-EFFECT TRANSISTOR, P-CHANNEL, SILICON TYPE 2N2609 (SUPERSEDING MIL-S-19500/296A)

Korean Agency for Technology and Standards (KATS)

  • KS C 5202-1980(2000) RELIABILITY ASSURED FIELD-EFFECT TRANSISTORS
  • KS C IEC 60747-8:2002 Discrete devices-Part 8:Field-effect transistors
  • KS C 5202-2004 RELIABILITY ASSURED FIELD-EFFECT TRANSISTORS
  • KS C IEC 61829:2005 Crystalline silicon photovoltaic(PV) array-On-site measurement of I-V characteristics
  • KS C IEC 61829:2016 Crystalline silicon photovoltaic(PV) array-On-site measurement of I-V characteristics
  • KS C IEC 61829-2021 Crystalline silicon photovoltaic(PV) array-On-site measurement of I-V characteristics
  • KS C IEC 60747-8:2020 Semiconductor devices — Discrete devices —Part 8: Field-effect transistors
  • KS C IEC 61829-2016(2021) Crystalline silicon photovoltaic(PV) array-On-site measurement of I-V characteristics
  • KS D 0205-2002(2022) Steel-Micrographic determination of the ferritic or austenitic grain size
  • KS D 0205-2002(2017) Steel-Micrographic determination of the ferritic or austenitic grain size
  • KS D 0205-1987 Steel-Micrographic determination of the ferritic or austenitic grain size
  • KS C IEC 60747-4-1-2020 Semiconductor devices-Discrete devices-Part 4-1:Microwave diodes and transistors-Microwave field effect transistors-Blank detail specification
  • KS C IEC 60444-2-2002(2017) Measurement of quartz crystal unit parameters by zero phase technique in a p-network-Part 2:Phase offset method for measurement of motional capacitance of quartz crystal units
  • KS C IEC 60747-4-1-2002(2017) Semiconductor devices-Discrete devices-Part 4-1:Microwave diodes and transistors-Microwave field effect transistors-Blank detail specification
  • KS C IEC 60444-2-2022 Measurement of quartz crystal unit parameters by zero phase technique in a p-network-Part 2:Phase offset method for measurement of motional capacitance of quartz crystal units

British Standards Institution (BSI)

  • BS IEC 60747-8:2010+A1:2021 Semiconductor devices. Discrete devices - Field-effect transistors
  • BS IEC 60747-8:2010 Semiconductor devices. Discrete devices. Field-effect transistors
  • BS IEC 60747-8:2001 Discrete semiconductor devices and integrated circuits - Field-effect transistors - Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors
  • BS EN 60444-2:1997 Measurement of quartz crystal unit parameters. Phase offset method for measurement of motional capacitance of quartz crystal units
  • BS EN ISO 11979-5:2020 Ophthalmic implants. Intraocular lenses - Biocompatibility
  • BS QC 750114:1996 Harmonized system of quality assessment for electronic components. Semiconductor devices. Discrete devices. Field-effect transistors. Blank detail specification for case-rated field-effect transistors for switching applications

International Electrotechnical Commission (IEC)

  • IEC 60747-8:2000 Semiconductor devices - Part 8: Field-effect transistors
  • IEC 60747-8-3:1995 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section 3: Blank detail specification for case-rated field-effect transistors for switching applications
  • IEC 60747-8-1:1987 Semiconductor devices - Discret devices. Part 8: Field-effect transistors. Blank detail specification for single-gate field-effect transistors, up to 5 W and 1 GHz.
  • IEC 61829:1995 Crystalline silicon photovoltaic (PV) array - On-site measurement of I-V characteristics
  • IEC 60747-8:2010/AMD1:2021 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • IEC 60747-8-2:1993 Semicoductor devices; discrete devices; part 8: field-effect transistors; section 2: blank detail specification for field-effect transistors for case-rated power amplifier applications
  • IEC 60747-8:2010+AMD1:2021 CSV Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • IEC 60747-8:1984 Semiconductor devices. Discrete devices. Part 8 : Field-effect transistors
  • IEC 60747-8:2021 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • IEC 60747-8:2010 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • IEC 60747-4-1:2000 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors; Microwave field effect transistors; Blank detail specification

YU-JUS

  • JUS N.R1.353-1979 Letter symbohfor semiconductor devices. Bipolar andfield-effect transistors.
  • JUS N.R1.390-1979 Bipolar tnmmton. Etsential ratings and chancteristics: bw-power signal transistors
  • JUS N.R1.373-1980 Semiconductor ?iodes. Essentialratings and characteristics. Low-power signaldiodes
  • JUS N.R1.392-1980 Field-effect transistors. Essential ratings and characteristics
  • JUS N.R1.323-1979 Termsand definitions for semiconductor devices. Bipolar and field-effect transistors.
  • JUS N.R1.451-1982 Field-effect transistor. General principles of measuring methods
  • JUS N.R1.330-1979 ipolar transistors. Definitions of scattering parameters
  • JUS N.R1.391-1979 Bvpolar transistors. Essential ratings and characteristics: power transistors

Japanese Industrial Standards Committee (JISC)

RU-GOST R

  • GOST 20398.3-1974 Field-effect transistors. Forward transconductance measurement technique
  • GOST 20398.2-1974 Field-effect transistors. Noise figure measurement technique
  • GOST 17466-1980 Transistors bipolar and field-effect. Basic parameters
  • GOST R IEC 61829-2013 Crystalline silicon photovoltaic batteries. On-site measurement of I-V characteristics
  • GOST 20398.11-1980 Field-effect transistors. Short-circuit equivalent input noise voltage measurement technique
  • GOST 20398.6-1974 Field-effect transistors. Gate leakage current measurement technique
  • GOST 20398.13-1980 Field-effect transistors. Drain source resistance measurement technique
  • GOST 20398.0-1983 Field-effect transistors. General requirements for measuring electrical parameters
  • GOST 20398.8-1974 Field-effect transistors. Drain current for V(Gs)=0 measurement technique
  • GOST 20398.12-1980 Field-effect transistors. Drain residual current measurement technique
  • GOST 20398.7-1974 Field-effect transistors. Threshold and cut-off voltage measurement technique
  • GOST 20398.1-1974 Field-effect transistors. Shot-circuit forward transfer admittance measurement technique
  • GOST 20398.4-1974 Field-effect transistors. Active output conductance component measurement technique

European Standard for Electrical and Electronic Components

  • EN 150012:1991 Blank detail specification: single gate field-effect transistors

CZ-CSN

PL-PKN

European Committee for Electrotechnical Standardization(CENELEC)

  • EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
  • EN 61829:2016 Photovoltaic (PV) array - On-site measurement of current-voltage characteristics
  • EN 61829:1998 Crystalline Silicon Photovoltaic (PV) Array On-Site Measurement of I-V Characteristics

GSO

  • OS GSO IEC 61829:2015 Crystalline silicon photovoltaic (PV) array - On-site measurement of I-V characteristics
  • BH GSO IEC 61829:2016 Crystalline silicon photovoltaic (PV) array - On-site measurement of I-V characteristics
  • GSO IEC 60747-8:2014 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • OS GSO IEC 60747-8:2014 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
  • GSO IEC 61829:2015 Crystalline silicon photovoltaic (PV) array - On-site measurement of I-V characteristics

IET - Institution of Engineering and Technology

TH-TISI

  • TIS 2124-2002 Semiconductor devices.discrete devices.part 8: field.effect transistors section three: blank detail specification for case.rated field.effect transistors for switching applications
  • TIS 2122-2002 Semiconductor devices.discrete devices.part 8: field.effect transistors section one: blank detail specification for single.gate field.effect transistors, up to 5 w and 1 ghz
  • TIS 2121-2002 Semiconductor devices.discrete devices.part 8: field.effect transistors
  • TIS 2123-2002 Semiconductor devices.discrete devices.part 8: field.effect transistors section two: blank detail specification for field.effect transistors for case.rated power amplifier applications

RO-ASRO

  • STAS SR CEI 747-8-1993 Semiconductor devices Discrete devices Part 8: Field effect transistors
  • STAS 12389-1985 FIELD-EFFECT TRANSISTORS Limiting values and basic electrical parameters nomenclature
  • STAS 7128/8-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for field effect transitors
  • STAS 12124/4-1983 Semiconductor devices FIELD-EFECT TRANZISTORS Methods for measuring electrical static parameters
  • STAS 12124/3-1983 Semiconductor devices FIFL D-EFFECT TRANZISTORS Methods for measuring electrical static parameters

KR-KS

  • KS C IEC 60747-8-2020 Semiconductor devices — Discrete devices —Part 8: Field-effect transistors
  • KS C IEC 61829-2016 Crystalline silicon photovoltaic(PV) array-On-site measurement of I-V characteristics

Danish Standards Foundation

  • DS/EN 61829:1999 Crystalline silicon photovoltaic (PV) array - On-site measurement of I-V characteristics

IN-BIS

  • IS 4400 Pt.10-1983 Measurement Methods for Semiconductor Devices Part 10 Field Effect Transistors

Defense Logistics Agency

Association Francaise de Normalisation

  • NF C57-108:2000 Crystalline silicon photovoltaic (PV) array - On site measurement of I-V characteristics.

AENOR

  • UNE-EN 61829:2000 Crystalline silicon pr?hotovoltaic (PV) array. On-site measurement of I-V characteristics.

International Organization for Standardization (ISO)

  • ISO 643:1983 Steels; Micrographic determination of the ferritic or austenitic grain size

American National Standards Institute (ANSI)

ES-UNE

  • UNE-EN 60444-2:1997 MEASUREMENT OF QUARTZ CRYSTAL UNIT PARAMETERS BY ZERO PHASE IN A PI-NETWORK. PART 2: PHASE OFFSET METHOD FOR MEASUREMENT OF MOTIONAL CAPACITANCE OF QUARTZ CRYSTAL UNITS (Endorsed by AENOR in October of 1997.)

IECQ - IEC: Quality Assessment System for Electronic Components

  • QC 750112-1987 Semiconductor Devices Discrete Devices Part 8: Field-Effect Transistors Section One - Blank Detail Specification for Single-Gate Field- Effect Transistors@ up to 5W and 1 GHz (IEC 747-8-1 ED 1)

Lithuanian Standards Office

  • LST EN 61829-2001 Crystalline silicon photovoltaic (PV) array. On-site measurement of I-V characteristics (IEC 61829:1995)