in vivo and in vitro half-life

in vivo and in vitro half-life, Total:483 items.

The international standard classification for "in vivo and in vitro half-life" includes: Rubber and plastics products , Integrated circuits. Microelectronics , Semiconductor devices , Textiles in general , Testing of metals in general , Semiconducting materials , Testing of metals , Farming and forestry in general , Electronic components in general , Optics and optical measurements , Software development and system documentation , Gases for industrial application , Chemical analysis , Farming and forestry , Plants and equipment for the food industry , Fire-fighting , Therapy equipment .

The Chinese standard classification for "in vivo and in vitro half-life" includes: Packaging method , Microcircuit in general , Semiconductor triode , Basic standards and general methods , Metal physical property test method , Semimetal and semiconductor material in general , Semiconductor integrated circuit , Plant quarantine, pest control , Inorganic chemicals in general , Semiconductor discrete devices in general , Software engineering , Industrial gas and chemical gas , Pesticide management and application method , Power semiconductor device and parts , Other food processing machinery , Technical management , Technical Management , Technical management , Semiconductor emitting device , Technical management , Medical ultrasound, laser, high-frequency instrument and equipment .

General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China

GB/T 36843-2018 Detection and identification of Candidatus Phytoplasma pyri
GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
GB/T 7092-1993 Outline dimensions of semiconductor integrated circuits
GB/T 42706.5-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices
GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry
GB/T 37131-2018(英文版) Nanotechnology - Testing method of UV-visible diffuse reflectance spectrum of semiconductor nanopowder materials
GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2：Deterioration mechanisms
GB/T 38386-2019 Gas analysis—Determination of oxynitride in gases—The method of Cavity Ring-Down Spectroscopy
GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
GB/T 14447-1993 Test method for electrostatic properties of plastic films--Half-life method
GB/T 1553-2009 Test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconduetivity decay
GB/T 42706.1-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 1：General
GB/T 19403.1-2003 Semiconductor devices—Integrated Circuits—Part 11:Section 1:Internal visual examination for semiconductor integrated circuits (excluding hybrid circuits)
GB/T 36646-2018 Software component management—Management information model
GB/T 1553-1997 Standard test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay
GB/T 14862-1993 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T 1553-2023 Test methods for minority carrier lifetime in bulk silicon and germanium—Photoconductivity decay method
GB/T 37131-2018e Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
GB/T 7581-1987 of outlines for semiconductor discrete devices
GB/T 11493-1989 Blank detail specification of packages for semiconductor integrated circuits
GB/T 15878-2015 Semiconductor integrated circuits―Specification of leadframes for small outline package
GB/T 12703.1-2008 Textile - Evaluation for electrostatic properties - Part 1: Static half period

Professional Standard - Textile

FZ/T 01042-1996 Determination of electrostatic half-life of electrostatic properties of textile materials

Professional Standard - Agriculture

NY/T 3377-2018 Splitting saw for cattle carcass
NY/T 3284-2018 Guidelines on the spectrum collection for solid formulation of pesticide by attenuated total reflection fourier transform infrared (ATR-FTIR) spectroscopy
NY/T 3401-2018 Washing device for inside & outside of poultry carcass

Professional Standard - Machinery

JB/T 5631-1991 Epitaxial Furnace for Semiconductor Devices. Energy Efficiency Standard
JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices
JB/T 6306-1992 Power semiconductor module dimensions

Professional Standard - Business

SB/T 10917-2012 Washing device for inside & outside of poultry carcass
SB/T 10603-2011 Splitting saw for cattle carcass

Group Standards of the People's Republic of China

T/QGCML 4323-2024 Intelligent semiconductor six-sided appearance optical image sorter
T/SZBX 061-2021 Crystalline silicon photovoltaic module with low degradation
T/CCPITCSC 131-2023 Integration of domestic and foreign trade—Evaluation specifications of intelligent adapted for the elderly
T/ZGKSL 019-2024 Anti-aging guideline for age-specific of human skin
T/CIET 776-2024 Technical Requirements for Special Gases for Semiconductors
T/CEAC 045-2024 Technical requirements for the application of stem cell exosomes in skin anti-aging
T/CCPITCSC 130-2023 Integration of domestic and foreign trade－Evaluation specification of commodity adapted for the elderly
T/GXAS 831-2024 Technical specification for enhanced external counter-pulsation therapy in stable chronic heart failure
T/ZGKSL 001-2022 Evaluation criteria for human skin aging
T/FJSX 0001-2023 Double hot-melt plastic steel lining covered with integrated reinforced pipe

Professional Standard - Electron

SJ 51420/2-1998 Detail specification of Type F ceramic FP for semiconductor integrated circuits
SJ/T 10176-1991 Detail specification of metal rhomb package for semiconductor integrated circuits
SJ 51420/3-2003 Detail specification of ceramic PGA for semiconductor integrated circuits
SJ/T 10308-1992 Detail specification of ceramic flat package for semiconductor integrated circuits
SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
SJ 20074-1992 Detailed Specifications for JΜ8305 Programmable Peripheral Equipment Interface of Semiconductor Integrated Circuit
SJ/T 11702-2018 Semiconductor integrated circuit serial peripheral interface test method
SJ 51420/1-1996 Detail specification of type D ceramic DIP for semiconductor integrated circuits
SJ 2750-1987 Outline dimensions for semiconductor laser diodes
SJ 2433-1984 Bonding sheet for semiconductor tubes
SJ/T 2658.4-2015 Measuring method for semiconductor infrared-emitting diode. Part 4: Total capacitance
SJ/T 2658.1-2015 Measuring method for semiconductor infrared-emitting diode. Part 1: General
SJ 2684-1986 Physical demensions for light emitting device of semiconductor
SJ 2757-1987 Method of measurement by infra-red reflection for charge carrier concentraiton of heavily doped semiconductors
SJ 2658.1-1986 Methods of Measurement for Semiconductor Infrared Diodes - General Rules
SJ/T 2658.14-2016 Measuring method for semiconductor infrared-emitting diode -Part 14: Junction temperature
SJ 50033/41-1994 Detail specification for type GR9414 semiconductor infrared light emitting diode
SJ/Z 9021.4-1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor devices
SJ/T 2658.15-2016 Measuring method for semiconductor infrared-emitting diode -Part 15: Thermal resistance
SJ 20744-1999 General rule of infrared absorption spectral analysis for the impurity concentration in semiconductor materials
SJ/T 10307-1992 Detail specification of frit-seal ceramic flat package for semiconductor integrated circuits
SJ/T 11818.1-2022 Semiconductor UV-emitting diodes Part 1: Test methods
SJ/T 11818.3-2022 Semiconductor UV-emitting diodes Part 3: Device Specifications
SJ 2247-1982 Outlines dimension for semiconductor optoelectronic devices

Military Standard of the People's Republic of China-General Armament Department

GJB 8190-2015 General specification for semiconductor solid-state light sources for aircraft exterior lighting
GJB 33/15-2011 Semiconductor optoelectronic device.Detail specification for type BT401 semiconductor infrared-emitting diode
GJB 923A-2004 General specification for packages of semiconductor discrete devices
GJB 1420B-2011(XG1-2015) Modification sheet of general specifications for semiconductor integrated circuit enclosures 1-2015
GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
GJB 1934-1994 General specification for semi-rigid coaxial radio frequency cables with wrinkled outer conductors
GJB 923B-2021 General Specification for Semiconductor Discrete Device Enclosures
GJB 1934A-2009 Cables,raido frequency,coaxial,semirigid,corrugated outer conductor,general specification for
GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
GJB 1557-1992 Semiconductor discrete device microwave diode dimensions
GJB 1557A-2021 Semiconductor discrete device microwave diode dimensions
GJB 1420/1-2000 Detailed specification for ceramic dual-row enclosures for semiconductor integrated circuits
GJB 33/16-2011 Semiconductor optoelectronic device.Detail specification for type 3DU32 semiconductor phototransistor

未注明发布机构

DVGW G 685-B2:2004-12 Technical specifications for gas metering and distribution within the settlement period
JEDEC JESD22-B118A-2021 Semiconductor Wafer and Die Backside External Visual Inspection

Taiwan Provincial Standard of the People's Republic of China

CNS 13382-5-2004 Implants for surgery - Metallic materials - Unalloyed titanium
CNS 13382.1-2004 Implants for surgery - Metallic materials - Wrought stainless steel
CNS 13382.5-2004 Implants for surgery - Metallic materials - Unalloyed titanium
CNS 13382-1-2004 Implants for surgery - Metallic materials - Wrought stainless steel

Professional Standard - Commodity Inspection

SN/T 4072-2014 Detection and identification of pear decline Phytoplasma

Professional Standard - Petroleum

SY/T 6306-1997 Fighting fires in and around flammable and combustible liquid atmospheric strorage tanks

Professional Standard - Medicine

YY/T 1751-2020 Therapeutic laser equipment—Laser diode irradiation therapeutic equipment for nasal cavity

British Standards Institution (BSI)

BS EN IEC 60747-16-7:2022 Semiconductor devices Microwave integrated circuits. Attenuators (British Standard)
BS IEC 62779-4:2020 Semiconductor devices. Semiconductor interface for human body communication - Capsule endoscope
18/30363340 DC BS IEC 62779-4. Semiconductor devices. Semiconductor interface for human body communication. Part 4. Semiconductor interface for capsule endoscopy using human body communication
BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS EN 60191-4:2000 Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
20/30414411 DC BS EN 60747-16-7. Semiconductor devices. Part 16-7. Microwave integrated circuits. Attenuators
BS 3934-4:1992 Mechanical standardization of semiconductor devices-Recommendations for a coding system and classification into forms of package outlines for semiconductor devices
BS 3934-6:1992 Mechanical standardization of semiconductor devices-Specification for the preparation of outline drawings of surface mounted semiconductor device packages
20/30431959 DC BS EN IEC 60747-16-7. Semiconductor devices. Part 16-7. Microwave integrated circuits. Attenuators
BS IEC 60747-14-5:2010 Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
BS EN IEC 62435-4:2018 Electronic components. Long-term storage of electronic semiconductor devices. Storage
BS EN 60191-4:2014+A1:2018 Mechanical standardization of semiconductor devices - Coding system and classification into forms of package outlines for semiconductor device packages
BS EN 60191-4:2014 Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
BS EN 60191-6:2004 Mechanical standardization of semiconductor devices-Part 6:General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2005 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 62779-1:2016 Semiconductor devices. Semiconductor interface for human body communication. General requirements
BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
BS IEC 60747-14-4:2011 Semiconductor devices. Discrete devices. Semiconductor accelerometers
BS EN IEC 62435-9:2021 Electronic components. Long-term storage of electronic semiconductor devices. Special cases
BS IEC 60747-14-2:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
BS IEC 60747-5-4:2022 Semiconductor devices - Optoelectronic devices. Semiconductor lasers
BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
BS IEC 60747-14-2:2000 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - Hall elements
BS IEC 60747-14-3:2001 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-Pressure sensors
BS EN 60747-15:2004 Discrete semiconductor devices. Isolated power semiconductor devices
BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
BS IEC 60747-14-1:2001 Discrete semiconductor devices and integrated circuits - Semiconductor devices - Semiconductor sensors - General and classification - Sensor generals and classification for semiconductor sensors
BS EN 62779-2:2016 Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
BS EN IEC 62435-7:2021 Electronic components. Long-term storage of electronic semiconductor devices. Micro-electromechanical devices
12/30258683 DC BS EN 62779-1. Semiconductor devices. Semiconductor interface for human body communication. General requirements
BS QC 790101:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Internal visual examination for semiconductor integr...
BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
12/30261676 DC BS EN 62779-2. Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
BS IEC 60747-14-1:2000 Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors-General and classification-Sensor generals and classification for semiconductor sensors
BS EN IEC 60747-15:2024 Semiconductor devices - Discrete devices. Isolated power semiconductor devices
BS IEC 60747-6:2000 Discrete semiconductor devices and integrated circuits - Thyristors
BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
BS IEC 60747-6:2001 Discrete semiconductor devices and integrated circuits - Thyristors
BS IEC 60747-5-4:2006 Semiconductor devices - Discrete devices - Optoelectronic devices - Semiconductor lasers
BS EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10:General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
BS IEC 60747-14-11:2021 Semiconductor devices - Semiconductor sensors. Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
BS IEC 63229:2021 Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
BS PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
BS EN 62779-3:2016 Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
BS EN IEC 62435-8:2020 Electronic components. Long-term storage of electronic semiconductor devices - Passive electronic devices
BS IEC 60747-14-1:2010 Semiconductor devices - Semiconductor sensors - Generic specification for sensors
BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods - External visual examination
PD IEC/PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges

Spanish Association for Standardization (UNE)

AENOR UNE 81214:1980 CHEMICAL AND MIXED FILTERS AGAINST AMMONIA. HALF LIFE
UNE-EN IEC 60747-16-7:2023 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (Endorsed by Asociación Española de Normalización in February of 2023.)
AENOR UNE 81220:1984 CHEMICAL AND MIXED FILTERS AGAINST CHLORINE. HALF LIFE
AENOR UNE 81224:1985 CHEMICAL AND MIXED FILTERS AGAINST HYDROSULFIC ACID (H2S). HALF LIFE
AENOR UNE 81222:1985 CHEMICAL AND MIXED FILTERS AGAINST SULFIDE ANHYDRIDE (SO2). HALF LIFE
AENOR UNE 81216:1980 CHEMICAL AND MIXED FILTERS AGAINST CARBON MONOXIDES. HALF LIFE
UNE-EN 60191-6:2009 Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)
UNE-EN 60191-4:2001 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
UNE-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)
UNE-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage (Endorsed by Asociación Española de Normalización in September of 2018.)
UNE-EN 60191-6-21:2010 Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorse...
UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
UNE-EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
UNE-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
UNE-EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)

International Telecommunication Union (ITU)

ITU-R P.676-1-1992 Attenuation by Atmospheric Gases in the Frequency Range 1-350 GHz
ITU-R P.676-9-2012 Atmospheric gas attenuation
ITU-R P.676-8-2009 Attenuation by atmospheric gases
ITU-R P.676-2016 Attenuation by atmospheric gases
ITU-R P.676-3-1997 Attenuation by Atmospheric Gases
ITU-R P.676-10-2013 Attenuation by atmospheric gases
ITU-R P.676-5-2001 Attenuation by Atmospheric Gases
ITU-R P.676-2-1995 Attenuation by Atmospheric Gases
ITU-R P.676-4-1999 Attenuation by Atmospheric Gases
ITU-R PN.835-1-1994 Reference Standard Atmosphere for Gaseous Attenuation
ITU-R PN.835-1992 Reference Standard Atmosphere for Gaseous Attenuation
ITU-R P.676-12-2019 Attenuation by atmospheric gases and related effects
ITU-R P.676-8 SPANISH-2009 Attenuation by atmospheric gases Atenuaci髇 debida a los gases atmosf閞icos
ITU-R P.676-8 FRENCH-2009 Attenuation by atmospheric gases Affaiblissement d?aux gaz de l'atmosph鑢e

International Electrotechnical Commission (IEC)

IEC 62779-4:2020 Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
IEC 60747-16-7:2022 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators
IEC 60191-4:2013+AMD1:2018 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60747-14-5:2010 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 60191-4:1987 Mechanical standardization of semiconductor devices. Part 4 : Coding system and classification into forms of package outlines for semiconductor devices
IEC 60149-4:1987 Mechanical standardization of semiconductor devices - Part 4: Coding system and classificatioin into forms of package outlines for semiconductor devices
IEC 60191-4:2013 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2018 Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60748-11-1:1992 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits
IEC 60191-4:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
IEC PAS 62240:2001 Use of semiconductor devices outside manufacturer's specified temperature ranges
IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
IEC 60747-14-2:2000 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements
IEC 60146:1973 Semiconductor convertors
IEC 60191-4/AMD2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 2
IEC 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
IEC 60747-14-4:2011 Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
IEC 60191-4/AMD1:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
IEC 60191-6/AMD1:1999 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1

Korean Agency for Technology and Standards (KATS)

KS C IEC 60748-11-1-2020 Semiconductor devices－Integrated circuits－Part 11－1：Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 60748-11-1:2004 Semiconductor devices－Integrated circuits－Part 11－1：Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 60748-11:2004 Semiconductor devices－Integrated circuits－Part 11：Sectional specification for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 60748-11-1-2004(2020) Semiconductor devices－Integrated circuits－Part 11－1：Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
KS C IEC PAS 62240-2008(2018) Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC PAS 62240-2008(2023) Use of semiconductor devices outside manufacturers specified temperature range
KS C IEC PAS 62240-2023 Use of semiconductor devices outside manufacturers specified temperature range
KS M ISO 24443-2014(2019) Cosmetics — Sun protection test methods — In vitro determination of UVA protection

YU-JUS

JUS M.A5.013-1991 Cone. Methods for testing of internat and external cones
JUS N.R1.322-1979 Terms and definitions for semiconductor ?evices. Thyristors

Danish Standards Foundation

DANSK DS/EN IEC 60747-16-7:2023 Semiconductor devices – Part 16-7: Microwave integrated circuits – Attenuators
DS/EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/EN 60191-4:2001 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DANSK DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DS/EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
DANSK DS/EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DANSK DS/EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DS/ISO 9613-1:1993 Acoustics. Attenuation of sound during propagation outdoors. Part 1: Calculation of the absorption of sound by the atmosphere
DANSK DS/EN IEC 62435-3:2020 Electronic components – Long-term storage of electronic semiconductor devices – Part 3: Data
DANSK DS/EN IEC 62435-4:2018 Electronic components – Long-term storage of electronic semiconductor devices – Part 4: Storage
DS/EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
DANSK DS/EN 62435-1:2017 Electronic components – Long-term storage of electronic semiconductor devices – Part 1: General
DS/EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
DS/EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

Comitato Elettrotecnico Italiano

CEI EN IEC 60747-16-7:2023 Semiconductor devices Part 16-7: Microwave integrated circuits - Attenuators
CEI EN 60191-6:2011 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
CEI EN 60191-4:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
CEI EN 60191-4/A1:2015 Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
CEI EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication Part 1: General requirements
CEI EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices Part 4: Storage
CEI EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices Part 3: Data
CEI EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices Part 1: General
CEI EN 60191-6-22:2014 Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic...

Association Francaise de Normalisation

NF EN IEC 60747-16-7:2023 Dispositifs à semiconducteurs - Partie 16-7 : circuits intégrés hyperfréquences - Atténuateurs
NF C96-016-7*NF EN IEC 60747-16-7:2023 Semiconductor devices - Part 16-7 : microwave integrated circuits - Attenuators
NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
NF C96-013-4*NF EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF C96-013-4/A2*NF EN 60191-4/A2:2003 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF C96-013-4/A1*NF EN 60191-4/A1:2002 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF C96-013-4*NF EN 60191-4:2000 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.
NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6: general rules for the preparation of outline drawings of packages for surface mount semiconductor devices
NF C96-013-4/A1*NF EN 60191-4/A1:2018 Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
NF C96-435-4*NF EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4 : storage
NF C96-013-6*NF EN 60191-6:2011 Mechanical standardization of semiconductor devices - Part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
NF C96-779-1*NF EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
NF EN IEC 62435-4:2018 Electronic components - Long-term storage of semiconductor electronic devices - Part 4: storage
NF EN IEC 62435-3:2020 Electronic components - Long-term storage of semiconductor electronic devices - Part 3: data
NF EN 62435-1:2017 Electronic components - Long-term storage of semiconductor electronic devices - Part 1: general
NF C96-435-1*NF EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
NF C96-435-3*NF EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3 : data
NF ISO 3936:2009 Reduction bushings with tenon drive to outer and inner cones 7/24 - Dimensions
NF ISO 5415:2008 Reduction bushings with 7/24 external and internal Morse cones, with incorporated screw
NF E62-522:1977 Reduction sleeves with tenon drive with external and internal 7/24 taper.
NF EN IEC 62435-9:2021 Electronic components - Long-term storage of semiconductor electronic devices - Part 9: special cases

American Water Works Association (AWWA)

AWWA JAW64704 Journal AWWA — Internal and External Sources of THM Precursors in a Midwestern Reservoir
AWWA JAW56657 Journal AWWA — Planning for Water Reclamation in a Semiconductor Fabrication Facility
AWWA JAW49874 Journal AWWA — Reusing Rinse Wastewater at a Semiconductor Plant

RO-ASRO

SR CEI 748-11-1-1992 Semiconductor devices Integrated circuits Part 11: Section 1: Internai visual examination for semiconductor integrated circuits excluding hybrid circuits

IN-BIS

IS 5000 OD.11-1971 Semiconductor device size device outline OD11
IS 5000 OB.4-1969 Basic overall dimensions of semiconductor devices OB4
IS 5000 OD.1-1969 Semiconductor device size device outline OD1
IS 5000 OD.6-1969 Semiconductor device size device outline OD6
IS 5000 OB.1-1969 Basic overall dimensions of semiconductor devices OB1
IS 5000 OD.13-1971 Semiconductor device size device outline OD13
IS 5000 OD.18-1974 Semiconductor device size device outline OD18
IS 5000 OB.2-1969 Basic overall dimensions of semiconductor devices OB2
IS 5000 OD.30-1981 Semiconductor device size device outline OD30
IS 5000 OD.10-1971 Semiconductor device size device outline OD1O
IS 5000 OD.9-1969 Semiconductor device size device outline OD9
IS 5000 OD.31-1981 Semiconductor device size device outline OD31
IS 5000 OD.4-1969 Semiconductor device size device outline OD4
IS 5000 OB.7-1969 Basic overall dimensions of semiconductor devices OB7
IS 5000 OD.2-1969 Semiconductor device size device outline OD2
IS 5000 OD.16-1973 Semiconductor device size device outline OD16
IS 5000 OB.5-1969 Basic dimensions of semiconductor devices OB5
IS 5000 OD.35-1981 Semiconductor device size device outline OD35
IS 5000 OD.15-1973 Semiconductor device size device outline OD15
IS 5000 OD.8-1969 Semiconductor device size device outline OD8
IS 5000 OD.19-1974 Semiconductor device size device outline OD19
IS 5000 OB.6-1969 Basic overall dimensions of semiconductor devices OB6
IS 5000 OD.14-1971 Semiconductor device size device outline OD14
IS 5000 OD.12-1971 Semiconductor device size device outline OD12
IS 5000 OD.7-1969 Semiconductor device size device outline OD7
IS 5000 OD.5-1969 Semiconductor device size device outline OD5
IS 5000 OD.33-1981 Semiconductor device size device outline OD33
IS 5000 OD.17-1974 Semiconductor device size device outline OD17
IS 5000 OD.21-1979 Semiconductor device size device outline OD 21
IS 5000 OD.24-1979 Semiconductor device size device outline OD 24
IS 5000 OD.36-1981 Semiconductor Device Dimensions Device Outline Figure 36
IS 5000 OD.22-1978 Semiconductor device size device outline OD 22
IS 5000 OD.29-1979 Semiconductor Device Dimensions Device Outline OD 29
IS 5000 OD.26-1978 Semiconductor device size device outline OD 26
IS 5000 OD.28-1978 Semiconductor device size device outline OD 28
IS 5000 OD.20-1978 Semiconductor device size device outline OD 20
IS 5000 OD.27-1978 Semiconductor Device Dimensions Device Outline OD 27
IS 5000 OD.23-1978 Semiconductor device size device outline OD 23
IS 5000 OD.25-1978 Semiconductor device size device outline OD 25
IS 5000 OD.37-1982 Semiconductor device size device outline size OD 37

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
JEDEC JESD74A-2007 Early Life Failure Rate Calculation Procedure for Semiconductor Components
JEDEC JEP78-1969 Relative Spectral Response Curves for Semiconductor Infrared Detectors

PL-PKN

PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits

American Society for Testing and Materials (ASTM)

ASTM E1332-10a Standard Classification for Rating Outdoor-Indoor Sound Attenuation
ASTM F28-91(1997) Standard Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay
ASTM E1332-16 Standard Classification for Rating Outdoor-Indoor Sound Attenuation
ASTM STP 850-1984 Semiconductor processing
ASTM F584-06 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
ASTM F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

German Institute for Standardization

DIN 41885:1976 Cases type 101 for semiconductor devices; main dimensions
DIN EN 62435-5:2017-10*VDE 0884-135-5:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-7:2022-10*VDE 0884-135-7:2022-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-4:2019-05*VDE 0884-135-4:2019-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-6:2019-04*VDE 0884-135-6:2019-04 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62779-1:2017-01*VDE 0884-79-1:2017-01 Semiconductor devices – Semiconductor interface for human body communication
DIN EN IEC 62435-9:2023-09*VDE 0884-135-9:2023-09 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62779-2:2017-01*VDE 0884-79-2:2017-01 Semiconductor devices – Semiconductor interface for human body communication
DIN EN 62435-1:2017-10*VDE 0884-135-1:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN IEC 62435-8:2022-11*VDE 0884-135-8:2022-11 Electronic components – Long-term storage of electronic semiconductor devices
DIN 41877:1971 Case 6 A 3 for semiconductor devices; main dimensions
DIN EN IEC 60747-16-7:2021-07 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English / Note: Date of issue 2021-06-04
DIN EN IEC 62435-3:2022-05*VDE 0884-135-3:2022-05 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62435-2:2017-10*VDE 0884-135-2:2017-10 Electronic components – Long-term storage of electronic semiconductor devices
DIN EN 62779-3:2017-03*VDE 0884-79-3:2017-03 Semiconductor devices – Semiconductor interface for human body communication
DIN EN IEC 60747-16-7:2024-04 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023
DIN EN IEC 60747-16-7:2024 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023
DIN EN IEC 62969-2:2018-09*VDE 0884-69-2:2018-09 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-4:2019-03*VDE 0884-69-4:2019-03 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-1:2018-08*VDE 0884-69-1:2018-08 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN EN IEC 62969-3:2018-12*VDE 0884-69-3:2018-12 Semiconductor devices – Semiconductor interface for automotive vehicles
DIN 41814-2:1976 Cases for semiconductor devices; cases type 160 to 168, main dimensions
DIN 41871:1971 Cases 1 A 2 and 1 A 3 for semiconductor devices; main dimensions
DIN 41888:1976 Cases type 106 and 107 for semiconductor devices; main dimensions
DIN 41884:1971 Case 118 A 2 for semiconductor devices; main dimensions
DIN EN 60191-4:2003 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
DIN EN IEC 60747-16-7:2021 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English
DIN 50443-1:1988 Testing of materials for use in semiconductor technology; detection of crystal defects and inhomogeneities in silicon single crystals by X-ray topography
DIN VDE V 0884-11:2017-01*VDE V 0884-11:2017-01 Semiconductor devices
DIN IEC 60747-11:1992 Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985
DIN EN IEC 60747-17:2021-10*VDE 0884-17:2021-10 Semiconductor devices
DIN EN IEC 60747-5-5:2021-10*VDE 0884-5:2021-10 Semiconductor devices
DIN IEC 747-11:1992 Semiconductor devices; Sectional specification for semiconductor devices
DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
DIN EN 60191-6-5:2002-05 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German vers...
DIN EN 60191-6-3:2001-06 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:200...
DIN EN 60191-4:2019 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
DIN 4518-3:1974 Semiconductor Paper
DIN EN 60191-6-6:2002-02 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German vers...
DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...
DIN EN 60191-6-8:2002-05 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); Ge...
DIN EN 60191-6-2:2002-09 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal package...
DIN EN 60191-6-22 E:2011 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
DIN 41867:1972 Cases 50 B3 and 50 B4 for semiconductor devices; main dimensions
DIN EN 60191-6-1:2002-08 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60...
DIN VDE 0493-200:2011 Radiation protection instrumentation - Periodic testing of installed in-vivo counters
DIN EN 60146-2:2001-02*VDE 0558-2:2001-02 Semiconductor converters
DIN 6855-1:1992 Quality control of nuclear medicine instruments; radiation counting systems for measurements in vivo and in vitro
DIN EN 60191-6-22 E:2011-08 Draft Document - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball G...
DIN 41891:1971 Cases 200 A 3 and 200 B 3 for semiconductor devices; main dimensions
DIN IEC 60747-14-5 E:2008 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
DIN IEC 60747-14-5 E:2008-03 Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
DIN 50446:1995 Testing of materials for semiconductor technology - Determination of defect types and defect densities of silicon epitaxial layers
DIN EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
DIN EN IEC 60747-16-7 E:2021 Draft Document - Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English
DIN EN 62417:2010-12 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010

Kingdom of Bahrain Testing and Metrology Directorate

BH GSO ASTM E1332:2023 Standard Classification for Rating Outdoor-Indoor Sound Attenuation
BH GSO IEC 60748-11-1:2016 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
BH GSO IEC 60191-6:2016 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BH GSO IEC 62435-4:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
BH GSO IEC 62435-1:2022 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
BH GSO IEC 62779-1:2022 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

GCC Standardization Organization

GSO ASTM E1332:2023 Standard Classification for Rating Outdoor-Indoor Sound Attenuation
GSO IEC 60747-14-5:2015 Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
GSO IEC 60747-15:2014 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
GSO IEC 60748-11-1:2014 Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
GSO IEC 62435-4:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
GSO IEC 62779-1:2021 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
GSO IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
GSO IEC 60747-14-2:2014 Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

Standard Association of Australia （SAA）

AS 60146.2:2001 Semiconductor converters - Self-commutated semiconductor converters including direct d.c. converters
AS 1955.2:1978 Semiconductor convertors - Semiconductor self-commutated convertors

GM North America

GM 9986117-2015 Fluid, Semi-Synthetic Electro-Hydraulic Steering System (Issue 2)
GMP.E/P.120-2010 Thermoplastic Elastomer Polyolefinic, Shore A80, Interior/Exterior, Integrally Colored Issue 3; Do Not Use on New Programs; Replaced by GMW15812
GM GMP.E/P.120-2002 Thermoplastic Elastomer Polyolefinic, Shore A80, Interior/Exterior, Integrally Colored
GM GMP.E/P.016-2002 Thermoplastic Elastomer Polyolefinic, Shore D50, Interior/Exterior, Integrally Colored
GM GMP.TES.025-2013 Thermoplastic Elastomer - Styrenic Block Copolymer, Shore A80, Interior/Exterior, Integrally Colored (Issue 2; Do Not Use on New Programs; No Replacement)
GMP.E/P.037-2010 Thermoplastic Elastomer Polyolefinic, Shore A87, Interior/Exterior Issue 4; Do Not Use on New Programs; Replaced by GMW15812
GMP.E/P.082-2010 Thermoplastic Elastomer Polyolefinic, Shore A62, Interior/Exterior Issue 3; Do Not Use on New Programs; Replaced by GMW15812
GMP.E/P.132-2011 Thermoplastic Elastomer Polyolefinic, Shore A75, Interior/Exterior Issue 2; Do Not Use on New Programs; Replaced by GMW15814
GMN8154-2011 Thermoplastic Elastomer Polyolefinic, Shore A65, Interior/Exterior Issue 2; Do Not Use on New Programs; Replaced by GMW15814
GMP.E/P.057-2010 Thermoplastic Elastomer Polyolefinic, Shore A73, Interior/Exterior Issue 6; Do Not Use on New Programs; Replaced by GMW15812
GM GMP.E/P.037-2001 Thermoplastic Elastomer Polyolefinic, Shore A87, Interior/Exterior
GM GMP.E/P.029-2001 Thermoplastic Elastomer Polyolefinic, Shore A67, Interior/Exterior
GMP.E/P.029-2010 Thermoplastic Elastomer Polyolefinic, Shore A67, Interior/Exterior Issue 3; Do Not Use on New Programs; Replaced by GMW15812
GM GMP.E/P.082-2002 Thermoplastic Elastomer Polyolefinic, Shore A62, Interior/Exterior
GM GMP.E/P.132-2003 Thermoplastic Elastomer Polyolefinic, Shore A75, Interior/Exterior
GM GMN8154-2003 Thermoplastic Elastomer Polyolefinic, Shore A65, Interior/Exterior
GM GMP.E/P.057-2002 Thermoplastic Elastomer Polyolefinic, Shore A73, Interior/Exterior
GM GMP.TES.027-2004 Thermoplastic Elastomer - Styrenic Block Copolymer, Shore A70, Interior/Exterior, Integrally Colored
GMP.E/P.160-2010 Thermoplastic Elastomer - Polyolefinic, Shore D40, Interior/Exterior Issue 2; Do Not Use on New Programs; Replaced by GMW15812

ESDU - Engineering Sciences Data Unit

A1-2009 FLUID MECHANICS@ INTERNAL FLOW SERIES:TITLES Issue 6
ESDU 04021-2012 Fluid Mechanics@ Internal Flow Series: Record of Documents (Issue 15)
ESDU 04021-2011 Fluid Mechanics@ Internal Flow Series: Record of Documents (Issue 13)
ESDU 03016-2003 Selection of lubricant class (liquids@ solids@ semi-solids and gases)

Gosstandart of Russia

GOST 23900-1987 Power semiconductor devices. Overall and mounting dimensions
GOST 23448-1979 Semiconductor infra-red emitting diodes. Basic dimensions
GOST 26282-1984 Semiconductor power converters ranging to 5 kV·A. Parameters
GOST 27591-1988 Power semiconductor modules. Orerall and mounting dimensions
GOST 19834.4-1979 Semiconductor radiating infra-red diodes. Methods of measurement of radiation power
GOST R 50471-1993 Semiconductor photoemitters. Measuring method for halfintensity angle
GOST R IEC 60748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
GOST R ISO 17593-2009 Clinical laboratory testing and in vitro medical devices. Requirements for in vitro monitoring systems for self-testing of oral anticoagulant therapy
GOST 7724-1977 Meat. Pork carcasses and semi-carcasses. Specifications
GOST 31476-2012 Pigs for slaughter. Rork carcasses and semi-carcasses. Specifications

Association of German Mechanical Engineers

VDI 2631-1968 TESTING INSIDE AND OUTSIDE CONE; TEST METHOD AND TEST MEANS

CZ-CSN

CSN 35 8701-1975 Terminology of semiconductors and semiconductor devices
CSN 56 8191-1998 Whole dates
CSN 35 8701 Z1-1997 Semiconductor naming
CSN 34 8023 Z3-1999 Porcelain insulator. Brackets for external lines up to 35 kV

National Fire Protection Association (NFPA)

NFPA 318-2012 Standard for the Protection of Semiconductor Fabrication Facilities Effective Date: 6/20/2011
NFPA 318-2015 Standard for the Protection of Semiconductor Fabrication Facilities (Effective Date: 5/19/2014)
NFPA 318-2009 Standard for the Protection of Semiconductor Fabrication Facilities Effective Date: 10/10/2008
NFPA FPH SECTION 6-30-2003 Semiconductor Manufacturing

AT-OVE/ON

OVE EN IEC 60747-16-7:2021 Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/757/CDV) (english version)

JP-JEITA

JEITA ED 7300A-2008 Recommended practice on standard for the preparation of outline drawings of semiconductor package
JEITA ED7500A-2-2006 Standard for the dimensions of semiconductor devices (Discrete semiconductor devices)

Association for Electrical, Electronic & Information Technologies (VDE)

VDE 0844-135-4-2019*DIN EN IEC 62435-4:2019 Long-term storage of electronic assemblies - Semiconductor components - Part 4: Storage
VDE 0493-200-2011 Radiation protection instrumentation - Periodic testing of installed in-vivo counters

American Petroleum Institute (API)

API PUBL 28-30726-1981 IN VIVO AND IN VITRO MUTAGENICITY STUDIES FLUID PROCESS COKE Sample 6-1-468
API PUBL 28-30725-1981 IN VITRO AND IN VIVO MUTAGENCITY STUDIES QUENCH WATER FROM DELAYED PROCESS COKE Liquid 7-1-100
API PUBL 27-30140-1979 IN VITRO AND INVIVO MUTAGENICITY STUDIES NO.2 HOME HEATING OIL Final Report
API PUBL 27-00325-1979 IN-VITRO AND IN-VIVO MUTAGENCITY STUDIES NEW OIL COMPOSITE - FINAL REPORT
API PUBL 30-31037-1982 MUTAGENCITY EVALUATION OF SIX PETROLEUM SUBSTANCES IN AN IN VIVO/IN VITRO URINE ASSAY

Lithuanian Standards Office

LST EN 60191-4+A1-2002/A2-2002 Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999/A2:2002)
LST EN 60191-4+A1-2002 Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999+A1:2001)
LST EN 60191-6-2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009)
LST EN 60191-6-22-2013 Mechanical standardization of semiconductor devices -- Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silic

British Standard / International Electrotechnical Commission

BS IEC 60747-5-4:2022+A1:2024 Semiconductor devices - Optoelectronic devices. Semiconductor lasers

European Committee for Electrotechnical Standardization（CENELEC）

EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data
EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

U.S. Military Regulations and Norms

ARMY A-A-59326/1 B-2011 COUPLING HALF, MALE BY INTERNAL PIPE THREAD, TYPE I

Military Standards (MIL-STD)

MIL MIL-DTL-28830E-2013 Cable, Radio Frequency, Coaxial, Semirigid, Corrugated Outer Conductor, General Specification for
MIL MIL-DTL-28830F-2016 Cable, Radio Frequency, Coaxial, Semirigid, Corrugated Outer Conductor, General Specification for
MIL MIL-S-19500/530-1979 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3906
MIL MIL-S-19500/529-1978 SEMICONDUCTOR DEVICE, TRANSISTOR, SILICON TYPE 2N3904
MIL MIL-S-19500/288-1964 SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON TYPE 2N2377
MIL MIL-S-19500/289-1964 Semiconductor Device, Transistor, PNP, Silicon Type 2N2378

Defense Logistics Agency

DLA QPL-28830-2013 Cable, Radio Frequency, Coaxial, Semirigid, Corrugated Outer Conductor, General Specification For
DLA QPL-28830-QPD-2011 Cable, Radio Frequency, Coaxial, Semirigid, Corrugated Outer Conductor, General Specification For
DLA QPL-28830-13 NOTICE 1-2008 Cable, Radio Frequency, Coaxial, Semirigid, Corrugated Outer Conductor, General Specification for
DLA MIL-DTL-28830 D-2005 CABLE, RADIO FREQUENCY, COAXIAL, SEMIRIGID, CORRUGATED OUTER CONDUCTOR, GENERAL SPECIFICATION FOR [Use In Lieu Of: DLA MIL-C-0028830 A]
DLA MIL-S-19500/529 VALID NOTICE 4-2011 Semiconductor Device, Transistor, Silicon Type 2N3904
DLA QPL-28830-13-2007 CABLE, RADIO FREQUENCY, COAXIAL, SEMIRIGID, CORRUGATED OUTER CONDUCTOR, GENERAL SPECIFICATION FOR
DLA MIL-S-19500/216 A VALID NOTICE 3-2004 SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON TYPE 2N1051

CENELEC - European Committee for Electrotechnical Standardization

EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Incorporates Amendment A1: 2018)
EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Swedish Institute for Standards

SS-EN 60191-4:2014 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
SS-EN 60191-6:2010 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
SS-EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
SS-EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
SS-EN IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
SS-EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Sil...
SS-EN IEC 61169-10:2024 Radio-frequency connectors – Part 10: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 3 mm (0,12 in) with snap-on coupling – Characteristic impedance 50 Ω (Type SMB)
SS-EN 62417:2011 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
SS-EN IEC 61169-4:2023 Radio-frequency connectors - Part 4: RF coaxial connectors with inner diameter of outer conductor 16 mm (0,63 in) with screw lock - Characteristic impedance 50 Ω (type 7-16)
SS-EN IEC 61169-21:2022 Radio-frequency connectors - Part 21: Sectional specification for RF connectors with inner diameter of outer conductor 9,5 mm (0,374 in) with screw coupling - Characteristic impedance 50 ohms (Type SC)

National Electrical Manufacturers Association（NEMA)

NEMA CB-4:1989 Semiconductor Graphite

SE-SIS

SIS SMS 2511-1974 Freezers for household use. Determination of externat dimensions and internal volumes
SIS 02 02 02-1966 Sampling of liquid, semi-liquid and certain solid products

The Directorate General of Specifications and Metrology (DGSM)

OS GSO IEC 60191-6:2015 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
OS GSO IEC 60191-6-22:2017 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

Society of Automotive Engineers (SAE)

SAE EIA4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
SAE EIA4900 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges
SAE EIA-4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges

Bureau of Indian Standards

IS 16676-2024 Solventless Liquid Epoxy System for Application on Interior and Exterior Surfaces of Steel Water Pipeline-Specification

PH-BPS

PNS IEC 62435-1:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
PNS IEC 62435-3:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data

Aerospace Industries Association

AIA NAS717 Semiconductor Diodes

Government Electronic & Information Technology Association

GEIA SP4900-2002 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges Comment Period Expires: May 27, 2002; ANSI/EIA-4900
GEIA-4900-2001 Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges

Indonesia Standards

SNI 19-0429-1989 Guide for sampling of liquid and semi solid materials

Institute of Electrical and Electronics Engineers (IEEE)

IEEE 256-1963 SEMICONDUCTOR DIODES

Others: In vivo and in vitro mergers and acquisitions,In vitro and in vivo study results,in vitro ddi and in vivo ddi,in vivo and in vitro half-life,Difference Between In Vivo and In Vitro Labeling,in vitro extrapolation