GB/T 29507-2013 in English

VALID

Test method for measuring flatness, thickness and total thickness vsriation on silicon wafers. Automated non-contact scanning

Issued on:2013-05-09
Implemented on:2014-02-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $260.00
$253.00

Standard No:	GB/T 29507-2013
Document status:	VALID
Title in English:	Test method for measuring flatness, thickness and total thickness vsriation on silicon wafers. Automated non-contact scanning
Title in Chinese:	硅片平整度、厚度及总厚度变化测试自动非接触扫描法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2013-05-09
Implemented on:	2014-02-01
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H80-Semimetal and semiconductor material in general
Professional Classification:	GB-National Standard
Related Keywords:	total thickness vsriation total thickness change silicon wafers thickness testing dry silicon wafers
Related Topics:	illegal scanner Multi-grained scanning silicon wafer Thickness dia Blade Thickness Gauge Fluid titanium sheet thickness Electrode Thickness Thickness English dia thickness photo thickness Gradient strain gauge Torch Thickness Flatness Automatic Thickness Gauge non-contact scanning Probe sheet thickness automatic scaling scanning method Optical Thickness Automatic scanner Gold test thickness Automatic scanning Electrode Thickness Beam splitter thickness scan density Contact scanning principle Test sample thickness and width Thickness test measurement Steel sheet thickness detection Thickness photoelectric Half thickness in general test Thickness test measurement Test plate thickness Electromagnetic sheet thickness Automatic Thickness Meter thickness change GBT29507 GB/T 29507-2013 Total thickness Silicon wafer flatness SEMI Non-contact metal thickness detection method strain sweep rheology zx-6dl test block thickness Glue thickness test Infrared fairing thickness test Flatness and thickness measurement methods Slide flatness Briefly describe the methods and requirements for flatness testing Epitaxial silicon wafer flatness Non-contact measurement accuracy Silicon wafer contact angle measurement Cell thickness Thickness length test Sheet thickness detection Silicon wafer standard thickness gb/t 29507-2013

《GB/T 29507-2013硅片平整度、厚度及总厚度变化测试自动非接触扫描法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。

Scope

This standard specifies the test for the flatness, thickness and total thickness change of silicon wafers with a diameter not less than 50 mm and a thickness not less than 100 μm for cutting, grinding, corrosion, polishing, epitaxy or other surface states. This standard is non-destructive, Non-contact automatic scanning test method, suitable for flatness and thickness testing of clean and dry silicon wafers, and is not affected by changes in the thickness of the silicon wafer, surface state and shape of the silicon wafer,

More samples: JGJ 94-2008 GB 50021-2001(2009) GB 18306-2015

Sample only — not a preview of GB/T 29507-2013

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