GB/T 6621-2009 in English

VALID

Testing methods for surface flatness of silicon slices

Issued on:2009-10-30
Implemented on:2010-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $110.00
$107.00

Standard No:	GB/T 6621-2009
Document status:	VALID
Title in English:	Testing methods for surface flatness of silicon slices
Title in Chinese:	硅片表面平整度测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2009-10-30
Implemented on:	2010-06-01
Superseding:	GB/T 6621-1995 Test methods for surface flatness of silicon polished slices
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H80-Semimetal and semiconductor material in general
Professional Classification:	GB-National Standard
Related Keywords:	silicon wafer surface surface flatness silicon slices scopethis standard silicon surface
Related Topics:	Surface Test Method silicon wafer silicon surface Silicon Surface Inspection wafer surface peak Surface Test Method Microdisc iso flatness surface tester Statement of test method Silicon sphere surface silicon surface Flatness Material Surface Test Methods probe surface probe surface Entire set of ELISA slides 7 pieces test wafer Test Fluids in Surface Testing test wafer silicon wafer for testing Silicon test piece Test Surface Moisture test plane plane Specific Surface Test Temperature surface test Surface Test Method water silicon surface Polar Surface Test Method GBT6621 GBT6621-1995 GB/T 6621-2009 Silicon wafer flatness SEMI Tablet Hardness Test Method Flatness detection method How to use the three-point surface flatness tester How to measure the flatness of printing surface The test methods for flatness include Pneumatic plane meter flatness Body flatness measurement method How to measure flatness Surface flatness detection method Material flatness test Ink flatness test method Standard method for testing the flatness and smoothness of alloy surfaces Methods to detect alloy surface flatness Silicone oil testing in fabrics Flatness test method Bottle mouth flatness detection method Test method for flatness of press load plate Beam and plate flatness measurement method Flatness test method Board flatness measurement method Flatness and thickness measurement methods Slide flatness Section flatness detection method Detection method of workpiece flatness Plastic surface flatness measurement method Briefly describe the methods and requirements for flatness testing How to operate the flatness meter Part flatness detection method How to test surface flatness Flatness and Parallelism Measurement Methods Steel flatness Workpiece flatness detection method Epitaxial silicon wafer flatness Aluminum profile flatness test method Stainless steel plate flatness detection method Metal surface flatness standards Silicone oil alkalinity test method Evaluation method of flatness Simple measurement method of flatness Platform flatness detection method Test method for surface flatness Plane flatness measurement method Measurement and Correction Methods for Rack Flatness Material flatness measurement method Component surface flatness detection method Methods to implement flatness detection Silicon wafer surface film Flatness testing methods and techniques Flatness detection method Product flatness test method Laser test method for flatness Sample surface flatness test method Prefabricated component flatness detection method Substrate flatness detection method Methods to characterize device flatness Fiber flatness test method Wafer flatness detection method End face flatness measurement method Bottle mouth flatness measurement method Rice field flatness measurement method Silicon powder content on silicon wafer surface Material flatness inspection method Surface flatness detection method The method for measuring cross-section flatness is Grating surface flatness Material flatness test method Flatness test methods include

《GB/T 6621-2009硅片表面平整度测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。

Scope

This standard specifies the method for measuring the flatness of silicon polished wafers with capacitive displacement sensors. Cutting wafers, grinding wafers, and corrosion wafers can also refer to this method. This standard is suitable for measuring the surface flatness of silicon polished wafers with standard diameters of 76mm, 100mm, 125mm, 150mm, 200mm, resistivity not greater than 200Ω•cm and thickness not greater than 1000μm and visually describing the contour of the silicon wafer surface.

More samples: GB 50021-2001(2009) GB 18306-2015 JJG 21-2008

Sample only — not a preview of GB/T 6621-2009

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