GB/T 6618-2009 in English

VALID

Test method for thickness and total thickness variation of silicon slices

Issued on:2009-10-30
Implemented on:2010-06-01
File Format:PDF
Delivery:Via email within 1~3 business days

Price(USD)： $180.00
$175.00

Standard No:	GB/T 6618-2009
Document status:	VALID
Title in English:	Test method for thickness and total thickness variation of silicon slices
Title in Chinese:	硅片厚度和总厚度变化测试方法
Language:	English
File Format:	Electronic (PDF)
Delivery:	Via email within 1~3 business days
Issued on:	2009-10-30
Implemented on:	2010-06-01
Superseding:	GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices
ICS Classification:	29.045-Semiconducting materials
Chinese Classification:	H80-Semimetal and semiconductor material in general
Professional Classification:	GB-National Standard
Related Keywords:	total thickness variation silicon slices scopethis standard single crystal slices silicon wafers thickness
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《GB/T 6618-2009硅片厚度和总厚度变化测试方法》由TC203（全国半导体设备和材料标准化技术委员会）归口，主管部门为国家标准化管理委员会。
本标准规定了硅单晶切割片、研磨片、抛光片和外延片(简称硅片)厚度和总厚度变化的分立式和扫
描式测量方法。
本标准适用于符合GB/T12964、GB/T12965、GB/T14139规定的尺寸的硅片的厚度和总厚度变
化的测量。在测试仪器允许的情况下,本标准也可用于其他规格硅片的厚度和总厚度变化的测量。

Scope

This standard specifies the discrete and scanning measurement methods for the thickness and total thickness variation of silicon single crystal slices, lapped slices, polished slices and epitaxial wafers (silicon wafers for short). This standard applies to the measurement of the thickness and total thickness variation of silicon wafers conforming to the dimensions specified in GB/T 12964, GB/T 12965, and GB/T 14139. This standard can also be used to measure the thickness and total thickness variation of silicon wafers with other specifications if the test equipment allows it.

More samples: JGJ 94-2008 DL/T 368-2010 YD/T 3934-2021

Sample only — not a preview of GB/T 6618-2009

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